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TLV2362

更新时间： 2024-09-14 22:37:11
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德州仪器 - TI 运算放大器
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17页 276K
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HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS

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TLV2361, TLV2361Y, TLV2362, TLV2362Y  
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS  
SLOS195B – FEBRUARY 1997 – REVISED OCTOBER 1998  
TLV2361 . . . DBV PACKAGE  
(TOP VIEW)  
Low Supply-Voltage  
Operation . . . V = ±1 V Min  
CC  
Wide Bandwidth . . . 7 MHz Typ at  
± = ±2.5 V  
5
1
2
3
IN+  
V
+
CC  
V
CC  
High Slew Rate . . . 3 V/µs Typ at  
± = ±2.5 V  
V
–
CC  
V
CC  
IN–  
Wide Output Voltage Swing . . . ±2.4 V Typ  
at V ± = ±2.5 V, R = 10 kΩ  
OUT  
4
CC  
L
Low Noise . . . 8 nV/√Hz Typ at f = 1 kHz  
TLV2362 . . . D, P, OR PW PACKAGE  
(TOP VIEW)  
Package Options Include SOT-23 (DBV)  
Package for the TLV2361 and Plastic  
Small-Outline (D), Thin Shrink  
Small-Outline (PW), and Dual-In-Line (P)  
Packages for the TLV2362  
1OUT  
1IN–  
1IN+  
V
+
CC  
1
2
3
4
8
7
6
5
2OUT  
2IN–  
2IN+  
V
–
CC  
description  
The TLV236x devices are high-performance dual operational amplifiers built using an original Texas  
Instruments bipolar process. These devices can be operated at a very low supply voltage (±1 V), while  
maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal  
conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other  
general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With  
their low distortion and low-noise performance, these devices are well suited for audio applications.  
The C-suffix devices are characterized for operation from 0°C to 70°C and the I-suffix devices are characterized  
for operation from –40°C to 85°C.  
TLV2361 AVAILABLE OPTIONS  
PACKAGED DEVICES  
CHIP  
‡
T
A
SYMBOL  
FORM  
(Y)  
SOT-23  
†
(DBV)  
0°C to 70°C  
TLV2361CDBV  
TLV2361IDBV  
VAAC  
VAAI  
TLV2361Y  
–40°C to 85°C  
†
‡
The DBV packages are only available taped and reeled.  
Chip forms are specified for operation at 25°C only.  
TLV2362 AVAILABLE OPTIONS  
PACKAGED DEVICES  
§
CHIP  
FORM  
(Y)  
‡
TSSOP  
(PW)  
T
A
SMALL OUTLINE  
(D)  
PLASTIC DIP  
(P)  
–20°C to 85°C  
TLV2362ID  
TLV2362IP  
TLV2362IPWR  
TLV2362Y  
‡
§
Chip forms are specified for operation at 25°C only.  
The D packages are available taped and reeled. Add an R to the package suffix (e.g., TLV2362IDR).  
The PW packages are available left-ended taped and reeled only, (e.g., TLV2362IPWR).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...17

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