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TLV2334IPWLE PDF预览

TLV2334IPWLE

更新时间： 2024-11-13 22:37:11
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德州仪器 - TI 运算放大器
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33页 499K
描述
LinCMOSE LOW-VOLTAGE MEDIUM-POWER OPERATIONAL AMPLIFIERS

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TLV2334IPWLE 数据手册

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TLV2332, TLV2332Y, TLV2334, TLV2334Y  
LinCMOS LOW-VOLTAGE MEDIUM-POWER  
OPERATIONAL AMPLIFIERS  
SLOS189 – FEBRUARY 1997  
TLV2332  
D OR P PACKAGE  
(TOP VIEW)  
Wide Range of Supply Voltages Over  
Specified Temperature Range:  
T = –40°C to 85°C . . . 2 V to 8 V  
A
Fully Characterized at 3 V and 5 V  
Single-Supply Operation  
1OUT  
1IN–  
1IN+  
/GND  
V
DD  
1
2
3
4
8
7
6
5
2OUT  
2IN–  
2IN+  
Common-Mode Input-Voltage Range  
Extends Below the Negative Rail and up to  
V
DD–  
V
–1 V at T = 25°C  
DD  
A
TLV2332  
PW PACKAGE  
(TOP VIEW)  
Output Voltage Range Includes Negative  
Rail  
12  
High Input Impedance . . . 10 Ω Typ  
1
2
3
4
8
7
6
5
1OUT  
1IN–  
1IN+  
/GND  
V
DD+  
ESD-Protection Circuitry  
2OUT  
2IN–  
2IN+  
Designed-In Latch-Up Immunity  
V
DD –  
description  
TLV2334  
D OR N PACKAGE  
(TOP VIEW)  
The TLV233x operational amplifiers are in a family  
of devices that has been specifically designed for  
use in low-voltage single-supply applications.  
Unlike the TLV2322 which is optimized for  
ultra-low power, the TLV233x is designed to  
provide a combination of low power and good ac  
performance. Each amplifier is fully functional  
down to a minimum supply voltage of 2 V, is fully  
characterized, tested, and specified at both 3-V  
and 5-V power supplies. The common-mode  
input-voltage range includes the negative rail and  
extends to within 1 V of the positive rail.  
1OUT  
4OUT  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1IN–  
1IN+  
4IN–  
4IN+  
V
V
DD+  
DD–/GND  
2IN+  
3IN+  
3IN–  
3OUT  
2N–  
2OUT  
8
TLV2334  
PW PACKAGE  
(TOP VIEW)  
Having a maximum supply current of only 310 µA  
per amplifier over full temperature range, the  
TLV233x devices offer a combination of good ac  
performance and microampere supply currents.  
From a 3-V power supply, the amplifier’s typical  
slew rate is 0.38 V/µs and its bandwidth is  
300 kHz.  
1
14  
1OUT  
1IN–  
1IN+  
4OUT  
4IN–  
4IN+  
V
2IN+  
V
DD+  
DD–/GND  
3IN+  
3IN–  
3OUT  
2IN–  
2OUT  
7
8
AVAILABLE OPTIONS  
PACKAGED DEVICES  
§
V
max  
CHIP FORM  
(Y)  
IO  
†
‡
T
A
SMALL OUTLINE  
(D)  
PLASTIC DIP PLASTIC DIP  
TSSOP  
(PW)  
AT 25°C  
(N)  
(P)  
TLV2332IP  
—
9 mV  
TLV2332ID  
TLV2334ID  
—
TLV2332IPWLE  
TLV2334IPWLE  
TLV2332Y  
TLV2334Y  
–40°C to 85°C  
10 mV  
TLV2334IN  
†
‡
§
The D package is available taped and reeled. Add R suffix to the device type (e.g., TLV2332IDR).  
The PW package is only available left-end taped and reeled (e.g., TLV2332IPWLE).  
Chip forms are tested at 25°C only.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
LinCMOS is a trademark of Texas Instruments Incorporated.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...33

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