生命周期: | Obsolete | 零件包装代码: | SOIC |
包装说明: | PLASTIC, MS-012AA, SOIC-8 | 针数: | 8 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | 风险等级: | 5.65 |
Is Samacsys: | N | 放大器类型: | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB): | 0.0008 µA | 标称共模抑制比: | 75 dB |
最大输入失调电压: | 3000 µV | JESD-30 代码: | R-PDSO-G8 |
长度: | 4.9 mm | 功能数量: | 2 |
端子数量: | 8 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 认证状态: | Not Qualified |
座面最大高度: | 1.75 mm | 标称压摆率: | 0.55 V/us |
子类别: | Operational Amplifier | 供电电压上限: | 16 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 标称均一增益带宽: | 670 kHz |
宽度: | 3.9 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TLV2262CP | TI |
获取价格 |
Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
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TLV2262CP | STMICROELECTRONICS |
获取价格 |
ADVANCED LINCOMS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
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TLV2262CPWLE | STMICROELECTRONICS |
获取价格 |
ADVANCED LINCOMS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
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TLV2262CPWLE | TI |
获取价格 |
Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
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TLV2262ID | TI |
获取价格 |
Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
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TLV2262ID | STMICROELECTRONICS |
获取价格 |
ADVANCED LINCOMS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
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TLV2262ID | ROCHESTER |
获取价格 |
DUAL OP-AMP, 3000 uV OFFSET-MAX, 0.67 MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, MS-012AA, SOI |
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TLV2262IDG4 | STMICROELECTRONICS |
获取价格 |
ADVANCED LINCOMS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
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TLV2262IDG4 | TI |
获取价格 |
Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
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TLV2262IDR | TI |
获取价格 |
Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
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