是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DFP | 包装说明: | DFP, FL10,.3 |
针数: | 10 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.33.00.01 |
风险等级: | 5.28 | 放大器类型: | OPERATIONAL AMPLIFIER |
架构: | VOLTAGE-FEEDBACK | 最大平均偏置电流 (IIB): | 0.0008 µA |
标称共模抑制比: | 75 dB | 频率补偿: | YES |
最大输入失调电压: | 1500 µV | JESD-30 代码: | R-GDFP-F10 |
长度: | 6.475 mm | 低-偏置: | YES |
低-失调: | NO | 微功率: | YES |
功能数量: | 2 | 端子数量: | 10 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装主体材料: | CERAMIC, GLASS-SEALED | 封装代码: | DFP |
封装等效代码: | FL10,.3 | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | +-1.35/+-4/2.7/8 V | 认证状态: | Not Qualified |
筛选级别: | MIL-PRF-38535 | 座面最大高度: | 2.03 mm |
最小摆率: | 0.3 V/us | 标称压摆率: | 0.55 V/us |
子类别: | Operational Amplifier | 最大压摆率: | 0.5 mA |
供电电压上限: | 16 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | FLAT |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 标称均一增益带宽: | 670 kHz |
最小电压增益: | 25000 | 宽度: | 6.225 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TLV2262AMUB | STMICROELECTRONICS |
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TLV2262AQD | STMICROELECTRONICS |
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TLV2262AQDR | TI |
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Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2262AQDR | STMICROELECTRONICS |
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TLV2262AQDRG4 | TI |
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Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |