TLP173A(TPL,F)

更新时间： 2024-11-11 13:14:47

品牌	Logo	应用领域
东芝 - TOSHIBA		光电继电器固态继电器输出元件通信
页数	文件大小	规格书
10页	249K
描述
Solid State Relay, TRANSISTOR OUTPUT SOLID STATE RELAY, 3750 V ISOLATION-MAX, ROHS COMPLIANT, 11-4C1, MINIFLAT, MFSOP-6

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中文翻译

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技术参数
数据手册

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TLP173A(TPL,F) 技术参数

是否Rohs认证：	符合	生命周期：	Not Recommended
包装说明：	MFSOP-6	Reach Compliance Code：	unknown
HTS代码：	8541.40.95.00	风险等级：	5.73
配置：	SINGLE	最大正向电流：	0.025 A
最大绝缘电压：	3750 V	元件数量：	1
最大通态电阻：	50 Ω	最高工作温度：	65 °C
最低工作温度：	-20 °C	光电设备类型：	TRANSISTOR OUTPUT SSR
Base Number Matches：	1

TLP173A(TPL,F) 数据手册

TLP173A

TOSHIBA Photocoupler Photorelay

TLP173A

Telecommunications

Control Equipment

Unit: mm

Data Acquisition System

Security Equipment

Measurement Equipment

The Toshiba TLP173A consists of a gallium arsenide infrared emitting

diode optically coupled to a photo-MOSFET in a MFSOP6 package.

This photorelay requires 2mA of LED current to turn it on. It is suitable

for applications that need electrical power savings.

•

4-pin SOP (MFSOP6): Height = 2.5 mm, pitch = 2.54 mm

Normally open (1-Form-A) device

Peak off-state voltage: 60 V (min)

Trigger LED current: 2 mA (max)

On-state current: 70 mA (max)

On-state resistance: 50 Ω (max)

JEDEC

JEITA

―

Isolation voltage: 3750 Vrms (min)

UL (pending approval) : UL1577, File No.E67349

c-UL (pending approval)

TOSHIBA

11-4C1

CSA Component Acceptance Service No. 5A File No.E67349

BSI (pending approval):

Weight: 0.09 g (typ.)

•

SEMKO (pending approval):

Option (V4) type

VDE (pending approval):

Maximum operating insulation voltage: 565Vpk

Highest permissible over voltage: 6000Vpk

Pin Configuration (top view)

Internal Circuit

1: Anode

3: Cathode

4: Drain

6: Drain

2009-12-22

12 3 4 5 6 7...10

中文翻译

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