Material Content Data Sheet
Sales Product Name TLE7250VLE
Issued
28. September 2015
MA#
MA001335652
PG-TSON-8-1
Package
Weight*
27.05 mg
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
1.493
0.003
0.012
0.236
9.586
0.035
0.029
1.507
13.092
0.387
0.043
0.156
0.468
5.52
0.01
0.04
0.87
35.44
0.13
0.11
5.57
48.41
1.43
0.16
0.58
1.73
5.52
55184
109
55184
leadframe
phosphorus
zinc
436
iron
8728
copper
36.36
0.13
354409
1305
363682
1305
wire
copper
encapsulation
carbon black
epoxy resin
silicondioxide
tin
1082
55704
484034
14307
1607
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
54.09
1.43
0.16
540820
14307
1607
leadfinish
plating
glue
silver
plastics
epoxy resin
silver
5774
noble metal
7440-22-4
2.31
17321
23095
*deviation
< 10%
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com