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TLE2227 PDF预览

TLE2227

更新时间: 2024-11-23 04:28:07
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描述
EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION DUAL OPERATIONAL AMPLIFIERS

TLE2227 数据手册

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TLE2227, TLE2227Y, TLE2237, TLE2237Y  
EXCALIBUR LOW-NOISE HIGH-SPEED  
PRECISION DUAL OPERATIONAL AMPLIFIERS  
SLOS184 – FEBRUARY 1997  
P PACKAGE  
(TOP VIEW)  
Outstanding Combination of DC Precision  
and AC Performance:  
Unity-Gain Bandwidth . . . 15 MHz Typ  
1OUT  
1IN–  
1IN+  
V
CC+  
1
2
3
4
8
7
6
5
V . . . 3.3 nV/Hz at f = 10 Hz Typ,  
n
2OUT  
2IN–  
2IN+  
2.5 nV/Hz at f = 1 kHz Typ  
V
A
. . . 100 µV Typ  
. . . 45 V/µV Typ With R = 2 kΩ  
IO  
V
CC–  
VD  
L
L
38 V/µV Typ With R = 1 kΩ  
DW PACKAGE  
(TOP VIEW)  
Available in 16-Pin Small-Outline  
Wide-Body Package  
Macromodels and Statistical Information  
Included  
NC  
NC  
V
NC  
NC  
1
2
3
4
5
6
7
8
16  
15  
14  
Output Features Saturation Recovery  
Circuitry  
1OUT  
1IN–  
1IN+  
CC+  
13 2OUT  
12 2IN–  
description  
11  
10  
9
2IN+  
NC  
V
CC–  
NC  
The TLE22x7C combines innovative circuit  
design expertise and high-quality process control  
techniques to produce a level of ac performance  
and dc precision previously unavailable in dual  
operational amplifiers. This device allows  
upgrades to systems that use lower-precision  
devices and is manufactured using Texas  
Instruments state-of-the-art Excalibur process.  
NC  
NC  
NC – No internal connection  
In the area of dc precision, the TLE22x7C offers a typical offset voltage of 100 µV, a common-mode rejection  
ratio of 115 dB (typ), a supply voltage rejection ratio of 120 dB (typ), and a dc gain of 45 V/µV (typ).  
The ac performance is highlighted by a typical unity-gain bandwidth specification of 15 MHz, 55° of phase  
margin, and noise voltage specifications of 3.3 nV/Hz and 2.5 nV/Hz at frequencies of 10 Hz and 1 kHz,  
respectively.  
The TLE22x7C is available in a wide variety of packages, including the industry standard 16-pin small-outline  
wide-body version for high-density system applications. This device is characterized for operation from 0°C to  
70°C.  
AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
typ  
CHIP FORM  
(Y)  
IO  
T
A
PLASTIC DIP  
(P)  
SMALL OUTLINE  
(DW)  
AT 25°C  
100 µV  
100 µV  
TLE2227CDW  
TLE2237CDW  
TLE2227CP  
TLE2237CP  
TLE2227Y  
TLE2237Y  
0°C to 70°C  
The DW package is available taped and reeled. Add R suffix to device type (e.g., TLE2227CDWR).  
Chip forms are tested at 25°C only.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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