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TLE2027AMD PDF预览

TLE2027AMD

更新时间: 2024-11-08 22:22:31
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路光电二极管PC
页数 文件大小 规格书
35页 560K
描述
EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS

TLE2027AMD 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:SOIC-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01Factory Lead Time:6 weeks
风险等级:1.49Samacsys Confidence:
Samacsys Status:ReleasedSamacsys PartID:417169
Samacsys Pin Count:8Samacsys Part Category:Integrated Circuit
Samacsys Package Category:OtherSamacsys Footprint Name:SOIC127P600X175-8N
Samacsys Released Date:2017-01-12 12:59:53Is Samacsys:N
放大器类型:OPERATIONAL AMPLIFIER架构:VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB):0.15 µA25C 时的最大偏置电流 (IIB):0.09 µA
最小共模抑制比:117 dB标称共模抑制比:131 dB
频率补偿:YES最大输入失调电流 (IIO):0.09 µA
最大输入失调电压:105 µVJESD-30 代码:R-PDSO-G8
JESD-609代码:e4长度:4.9 mm
低-偏置:NO低-失调:YES
微功率:NO湿度敏感等级:1
负供电电压上限:-19 V标称负供电电压 (Vsup):-15 V
功能数量:1端子数量:8
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE包装方法:TR
峰值回流温度(摄氏度):260功率:NO
电源:+-15 V可编程功率:NO
认证状态:Not Qualified座面最大高度:1.75 mm
最小摆率:1 V/us标称压摆率:2.8 V/us
子类别:Operational Amplifier最大压摆率:5.6 mA
供电电压上限:19 V标称供电电压 (Vsup):15 V
表面贴装:YES技术:BIPOLAR
温度等级:MILITARY端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
标称均一增益带宽:13000 kHz最小电压增益:8000000
宽带:NO宽度:3.9 mm
Base Number Matches:1

TLE2027AMD 数据手册

 浏览型号TLE2027AMD的Datasheet PDF文件第2页浏览型号TLE2027AMD的Datasheet PDF文件第3页浏览型号TLE2027AMD的Datasheet PDF文件第4页浏览型号TLE2027AMD的Datasheet PDF文件第5页浏览型号TLE2027AMD的Datasheet PDF文件第6页浏览型号TLE2027AMD的Datasheet PDF文件第7页 
TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y  
EXCALIBUR LOW-NOISE HIGH-SPEED  
PRECISION OPERATIONAL AMPLIFIERS  
SLOS192 – FEBRUARY 1997  
D, JG, OR P PACKAGE  
Outstanding Combination of dc Precision  
and AC Performance:  
(TOP VIEW)  
Unity-Gain Bandwidth . . . 15 MHz Typ  
OFFSET N1  
IN –  
OFFSET N2  
1
2
3
4
8
7
6
5
V
. . . . 3.3 nV/Hz at f = 10 Hz Typ,  
2.5 nV/Hz at f = 1 kHz Typ  
. . . . 25 µV Max  
n
V
CC +  
IN +  
OUT  
NC  
V
A
IO  
V
CC –  
. . . 45 V/µV Typ With R = 2 k,  
VD  
L
19 V/µV Typ With R = 600 Ω  
L
Available in Standard-Pinout Small-Outline  
Package  
FK PACKAGE  
(TOP VIEW)  
Output Features Saturation Recovery  
Circuitry  
Macromodels and Statistical information  
description  
3
2 1 20 19  
NC  
NC  
18  
17  
16  
15  
14  
4
The TLE20x7 and TLE20x7A contain innovative  
circuit design expertise and high-quality process  
control techniques to produce a level of ac  
performance and dc precision previously unavail-  
able in single operational amplifiers. Manufac-  
tured using Texas Instruments state-of-the-art  
Excalibur process, these devices allow upgrades  
to systems that use lower-precision devices.  
V
IN–  
NC  
IN+  
NC  
5
6
7
8
CC+  
NC  
OUT  
NC  
9 10 11 12 13  
In the area of dc precision, the TLE20x7 and  
TLE20x7A offer maximum offset voltages of  
100 µV and 25 µV, respectively, common-mode  
rejection ratio of 131 dB (typ), supply voltage  
rejection ratio of 144 dB (typ), and dc gain of  
45 V/µV (typ).  
AVAILABLE OPTIONS  
PACKAGED DEVICES  
CHIP  
FORM  
(Y)  
V
IO  
max AT  
25°C  
CHIP  
CARRIER  
(FK)  
CERAMIC  
PLASTIC  
DIP  
SMALL  
OUTLINE  
(D)  
T
A
DIP  
(JG)  
(P)  
TLE2027ACD  
TLE2037ACD  
TLE2027ACP  
TLE2037ACP  
TLE2027Y  
TLE2037Y  
25 µV  
100 µV  
25 µV  
0°C to 70°C  
40°C to 105°C  
55
°
C to 125
°
C  
TLE2027CD  
TLE2037CD  
TLE2027CP  
TLE2037CP  
TLE2027Y  
TLE2037Y  
TLE2027AID  
TLE2037AID  
TLE2027AIP  
TLE2037AIP  
TLE2027ID  
TLE2037ID  
TLE2027IP  
TLE2037IP  
100 µV  
25 µV  
TLE2027AMD  
TLE2037AMD  
TLE2027AMFK  
TLE2037AMFK  
TLE2027AMJG  
TLE2037AMJG  
TLE2027AMP  
TLE2037AMP  
TLE2027MD  
TLE2037MD  
TLE2027MFK  
TLE2037MFK  
TLE2027MJG  
TLE2037MJG  
TLE2027MP  
TLE2037MP  
100 µV  
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2027ACDR).  
Chip forms are tested at 25°C only.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

TLE2027AMD 替代型号

型号 品牌 替代类型 描述 数据表
TLE2027AMDG4 TI

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