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TLE2027A

更新时间： 2024-11-08 22:35:03
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德州仪器 - TI 运算放大器
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35页 560K
描述
EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS

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TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y  
EXCALIBUR LOW-NOISE HIGH-SPEED  
PRECISION OPERATIONAL AMPLIFIERS  
SLOS192 – FEBRUARY 1997  
D, JG, OR P PACKAGE  
Outstanding Combination of dc Precision  
and AC Performance:  
(TOP VIEW)  
Unity-Gain Bandwidth . . . 15 MHz Typ  
OFFSET N1  
IN –  
OFFSET N2  
1
2
3
4
8
7
6
5
V
. . . . 3.3 nV/√Hz at f = 10 Hz Typ,  
2.5 nV/√Hz at f = 1 kHz Typ  
. . . . 25 µV Max  
n
V
CC +  
IN +  
OUT  
NC  
V
A
IO  
V
CC –  
. . . 45 V/µV Typ With R = 2 kΩ,  
VD  
L
19 V/µV Typ With R = 600 Ω  
L
Available in Standard-Pinout Small-Outline  
Package  
FK PACKAGE  
(TOP VIEW)  
Output Features Saturation Recovery  
Circuitry  
Macromodels and Statistical information  
description  
3
2 1 20 19  
NC  
NC  
18  
17  
16  
15  
14  
4
The TLE20x7 and TLE20x7A contain innovative  
circuit design expertise and high-quality process  
control techniques to produce a level of ac  
performance and dc precision previously unavail-  
able in single operational amplifiers. Manufac-  
tured using Texas Instruments state-of-the-art  
Excalibur process, these devices allow upgrades  
to systems that use lower-precision devices.  
V
IN–  
NC  
IN+  
NC  
5
6
7
8
CC+  
NC  
OUT  
NC  
9 10 11 12 13  
In the area of dc precision, the TLE20x7 and  
TLE20x7A offer maximum offset voltages of  
100 µV and 25 µV, respectively, common-mode  
rejection ratio of 131 dB (typ), supply voltage  
rejection ratio of 144 dB (typ), and dc gain of  
45 V/µV (typ).  
AVAILABLE OPTIONS  
PACKAGED DEVICES  
CHIP  
FORM  
(Y)  
V
IO  
max AT  
25°C  
CHIP  
CARRIER  
(FK)  
CERAMIC  
PLASTIC  
DIP  
SMALL  
OUTLINE  
(D)  
‡
T
A
†
DIP  
(JG)  
(P)  
TLE2027ACD  
TLE2037ACD  
—
—
—
—
TLE2027ACP  
TLE2037ACP  
TLE2027Y  
TLE2037Y  
25 µV  
100 µV  
25 µV  
0°C to 70°C  
–40°C to 105°C  
–55
°
C to 125
°
C  
TLE2027CD  
TLE2037CD  
—
—
—
—
TLE2027CP  
TLE2037CP  
TLE2027Y  
TLE2037Y  
TLE2027AID  
TLE2037AID  
—
—
—
—
TLE2027AIP  
TLE2037AIP  
—
—
—
—
TLE2027ID  
TLE2037ID  
—
—
—
—
TLE2027IP  
TLE2037IP  
100 µV  
25 µV  
TLE2027AMD  
TLE2037AMD  
TLE2027AMFK  
TLE2037AMFK  
TLE2027AMJG  
TLE2037AMJG  
TLE2027AMP  
TLE2037AMP  
TLE2027MD  
TLE2037MD  
TLE2027MFK  
TLE2037MFK  
TLE2027MJG  
TLE2037MJG  
TLE2027MP  
TLE2037MP  
100 µV  
†
‡
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2027ACDR).  
Chip forms are tested at 25°C only.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...35

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