TLC976C

更新时间： 2024-09-29 03:59:27

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
17页	220K
描述
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR

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TLC976C 数据手册

TLC976C

10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR

SLAS193 – OCTOBER 1998

DGG PACKAGE

(TOP VIEW)

Correlated Double Sampling (CDS), AGC

and High Speed 10-Bit ADC in a Single

Package

SHV

GND1

SHR

5-V Analog Power Supply and 3.3-V Digital

Power Supply

VCC1

BLK-PULSE

OFFSET

VCC3

CLP2

Power Down Mode

DATA-IN

56-Pin TSSOP (DGG) Package with

Multichip Module Assembly for Isolation

DRIVE-OUT

GND3

AGCGAIN

OBCLP

AGCCLP

SH-PULSE

GND2

CDS-STBY

VRB-OUT

VRT-OUT

A-SUB

CDS/AGC

AGC Gain Range of 5 dB to 39 dB

Black Level Clamp Circuit

VCC2

Direct Connection to ADC Input

Voltage Reference for ADC

D-SUB 12

DVSS 13

D0 14

45 A-SUB

44 DVDD

43 AVSS

AVSS

VIN

Analog-to-Digital Converter

10-Bit Resolution

D-SUB

AVSS

VRB-IN

VRT-IN

AVSS

AVDD

AD-STBY

Maximum Conversion Rate . . . 20 MSPS

(MIN)

DVSS

DVDD

Differential Nonlinearity . . . 0.75 LSB (TYP)

Analog Input Voltage Range of 2 Vp-p

3.3 V CMOS Digital Interface

Applications

PC Camera

RESET

DVSS

AVDD

Digital Camera

Camcorder

CLK

CCD Scanner

description

The TLC976 is a multichip module (MCM) subsystem designed for interfacing Charge-Coupled Device (CCD)

in camcorder and digital camera systems. The TLC976 includes correlated double sampler (CDS), automatic

gain control (AGC), black level clamp circuit, 10 bit, 20 MSPS analog-to-digital converter (ADC), and internal

reference voltage generator for ADC.

The CDS/AGC can be connected directly to the ADC input or a separate signal can be connected directly to

the ADC input. A power-down mode is provided.

Assembled using the MCM process, the TLC976 provides isolation between the noisy digital domain and the

noise sensitive analog signals. The CDS/PGA, black level clamps are on one die and the ADC is on a separate

die. The separate dies significantly reduce the substrate noise to the analog section.

The TLC976 comes in a 56-pin TSSOP package with 0,50 mm pin pitch. This is about 25% smaller than using

two separate 32-pin quad flat packs (QFP).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

12 3 4 5 6 7...17

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与TLC976C相关器件

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