TL1051FR-X

更新时间： 2024-09-21 13:14:43

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
13页	173K
描述
Video Preprocessor Circuit 44-QFP

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TL1051FR-X 技术参数

是否无铅：	含铅	生命周期：	Obsolete
零件包装代码：	QFP	包装说明：	QFP,
针数：	44	Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01	风险等级：	5.84
商用集成电路类型：	CONSUMER CIRCUIT	JESD-30 代码：	S-PQFP-G44
长度：	10 mm	功能数量：	1
端子数量：	44	最高工作温度：	45 °C
最低工作温度：	-20 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	QFP	封装形状：	SQUARE
封装形式：	FLATPACK	认证状态：	Not Qualified
座面最大高度：	2.25 mm	最大压摆率：	50 mA
最大供电电压 (Vsup)：	5.2 V	最小供电电压 (Vsup)：	4.8 V
表面贴装：	YES	技术：	BIPOLAR
温度等级：	COMMERCIAL	端子形式：	GULL WING
端子节距：	0.8 mm	端子位置：	QUAD
宽度：	10 mm	Base Number Matches：	1

TL1051FR-X 数据手册

TL1051

VIDEO PREPROCESSOR CIRCUIT

SOCS032B – NOVEMBER 1991

•

Solid-State Reliability

•

Clamp Pulse-Select Option

Supports Both Color and Monochrome

Applications

White-Clip Function for Y Signal

Gain Control for R, G, B, and Y

•

Three Independent Channels Available for

Use With RGB Monitors

Noise Suppression During Video-Blanking

Periods

Y Signal Generated From Three

Independent Channels

description

TheTL1051isabipolarmonolithicintegratedcircuitdesignedforuseinpreprocessingthreechannelsofTICCD

image sensors. It receives video inputs from the TI TL1593 three-channel sample-and-hold circuit and outputs

three processed channel signals and a single multiplexed Y (luminance) signal. Processing functions of the

TL1051 include gain, automatic gain control, clamp, white balance, and white clip.

TheTL1051issuppliedina44-pinsurface-mountplasticpackageandischaracterizedforoperationfrom–20°C

to 45°C.

FR PACKAGE

(TOP VIEW)

44 43 42 41 40 39 38 37 36 35 34

AGCOUT

REF2V

AGCCONT

AGCLMT

BOUT

GOUT

ROUT

YOUT

YALC

CONTB

CONTA

BIN

GIN

RIN

CLPLVLB

CLPLVLG 10

CLPLVLR 11

WCPCONT

YCLAMP

12 13 14 15 16 17 18 19 20 21 22

NC – No internal connection

This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These

circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,

Method3015;however, precautionsshouldbetakentoavoidapplicationofanyvoltagehigherthanmaximum-ratedvoltagestothese

high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in

conductive foam. In a circuit, unused inputs should always be connected to an appropriate logic voltage level, preferably either V

Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices and Assemblies available from Texas Instruments.

or ground.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

4-1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

12 3 4 5 6 7...13

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