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TL082CMX

更新时间： 2024-11-22 04:28:15
品牌 Logo 应用领域
美国国家半导体 - NSC 运算放大器放大器电路光电二极管
页数 文件大小 规格书
3页 84K
描述
Engineering Project Manager

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中文翻译

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TL082CMX 技术参数

是否Rohs认证： 不符合生命周期：Transferred
零件包装代码：SOIC包装说明：SOIC-8
针数：8Reach Compliance Code：not_compliant
ECCN代码：EAR99HTS代码：8542.33.00.01
风险等级：5.15放大器类型：OPERATIONAL AMPLIFIER
架构：VOLTAGE-FEEDBACK最大平均偏置电流 (IIB)：0.0004 µA
25C 时的最大偏置电流 (IIB)：0.0004 µA最小共模抑制比：70 dB
标称共模抑制比：100 dB频率补偿：YES
最大输入失调电流 (IIO)：0.004 µA最大输入失调电压：20000 µV
JESD-30 代码：R-PDSO-G8JESD-609代码：e0
长度：4.9 mm低-偏置：YES
低-失调：NO湿度敏感等级：1
负供电电压上限：-18 V标称负供电电压 (Vsup)：-15 V
功能数量：2端子数量：8
最高工作温度：70 °C最低工作温度：
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装等效代码：SOP8,.25封装形状：RECTANGULAR
封装形式：SMALL OUTLINE包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：235电源：+-15 V
认证状态：Not Qualified座面最大高度：1.75 mm
最小摆率：8 V/us标称压摆率：13 V/us
子类别：Operational Amplifier最大压摆率：5.6 mA
供电电压上限：18 V标称供电电压 (Vsup)：15 V
表面贴装：YES技术：BIPOLAR
温度等级：COMMERCIAL端子面层：Tin/Lead (Sn/Pb)
端子形式：GULL WING端子节距：1.27 mm
端子位置：DUAL处于峰值回流温度下的最长时间：30
标称均一增益带宽：4000 kHz最小电压增益：15000
宽度：3.9 mmBase Number Matches：1

TL082CMX 数据手册

 浏览型号TL082CMX的Datasheet PDF文件第2页浏览型号TL082CMX的Datasheet PDF文件第3页 
Company  
URL for Additional Information  
National Semiconductor  
http://www.national.com/quality/green/  
Contact  
Title  
Phone  
Email  
Engineering Project Manager  
Green.Project@nsc.com  
Gloria Gordon  
1-408-721-8435  
Part Number  
MSL Rating  
Peak Body Temp C  
MaxTime (Sec)  
Cycles  
TL082CMX  
1
235  
30  
4
Document Date  
Weight (mg)  
Unit Type  
Contains Lead(Pb) and is NOT European RoHS Compliant  
NOT China RoHS Compliant  
29-Dec-2007  
70.000  
Each  
Homogeneous Material Composition Declaration for Electronic Products  
Item  
Weight (mg)  
Component  
CAS#  
Weight (mg)  
Item-ppm  
Part-ppm  
517,359  
Plastic  
44.710 SiO2  
60676-86-0  
25928-94-3  
1309-64-4  
36.215  
810,000  
Epoxy Resin  
Sb2O3  
7.243  
0.894  
0.358  
20.036  
0.493  
0.025  
0.006  
2.346  
0.014  
1.564  
0.276  
0.203  
0.068  
0.180  
0.080  
162,000  
20,000  
8,000  
103,472  
12,774  
5,110  
286,225  
7,049  
352  
Brominated Epoxy  
40039-93-8  
7440-50-8  
7439-89-6  
7440-66-6  
7723-14-0  
7440-21-3  
7429-90-5  
7440-31-5  
7439-92-1  
7440-22-4  
25928-94-3  
7440-22-4  
7440-57-5  
Leadframe  
20.560 Cu  
974,500  
24,000  
1,200  
Fe  
Zn  
P
300  
88  
Chip  
2.360 Si  
Al  
994,000  
6,000  
33,512  
202  
Ext. LeadFinish  
Die Attach  
1.840 Sn  
Pb  
850,000  
150,000  
750,000  
250,000  
1,000,000  
1,000,000  
22,343  
3,943  
2,893  
964  
0.270 Ag  
Epoxy Resin  
Int. LeadFinish  
Wires  
0.180 Ag  
0.080 Au  
2,571  
1,143  
Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing.  
Additionally, the following should be noted:  
1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties.  
2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.  
RoHS Material Composition Declaration  
RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent  
Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass  
(100 PPM) of homogeneous material for Cadmium  
RoHS Directive  
2002/95/EC  
Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date.  
1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances  
2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A  
threshold levels, except lead in RoHS exempt applications 5, 7a and 7c.  
2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do  
not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in  
solder and RoHS exempt applications 5, 7a and 7c.  
3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for  
Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at  
www.national.com/quality/green/.  
4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that  
Deplete the Ozone Layer and U.S. Clean Air Act, Title VI.  
National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information  
provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from  
default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default  
may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations  
are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers  
consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s  
standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in  
connection with the information provided herein unless otherwise provided by a written contract signed by both parties.  
NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION.  
Gerry Fields  
Vice President Quality  
National Semiconductor  
Page 1 of 3  
123

中文翻译

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