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TL082BID PDF预览

TL082BID

更新时间: 2024-11-03 22:49:47
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 运算放大器放大器电路光电二极管
页数 文件大小 规格书
11页 110K
描述
GENERAL PURPOSE J-FET DUAL OPERATIONAL AMPLIFIERS

TL082BID 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:ROHS COMPLIANT, PLASTIC, MICRO, SOP-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.57
Is Samacsys:N放大器类型:OPERATIONAL AMPLIFIER
架构:VOLTAGE-FEEDBACK最大平均偏置电流 (IIB):0.02 µA
25C 时的最大偏置电流 (IIB):0.0002 µA标称共模抑制比:86 dB
频率补偿:YES最大输入失调电流 (IIO):0.004 µA
最大输入失调电压:5000 µVJESD-30 代码:R-PDSO-G8
JESD-609代码:e4长度:4.9 mm
低-偏置:YES低-失调:NO
湿度敏感等级:1负供电电压上限:-18 V
标称负供电电压 (Vsup):-15 V功能数量:2
端子数量:8最高工作温度:105 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
包装方法:TUBE峰值回流温度(摄氏度):260
电源:+-15 V认证状态:Not Qualified
座面最大高度:1.75 mm最小摆率:8 V/us
标称压摆率:16 V/us子类别:Operational Amplifier
最大压摆率:2.5 mA供电电压上限:18 V
标称供电电压 (Vsup):15 V表面贴装:YES
技术:BIPOLAR温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40标称均一增益带宽:4000 kHz
最小电压增益:25000宽度:3.9 mm
Base Number Matches:1

TL082BID 数据手册

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TL082  
TL082A - TL082B  
GENERAL PURPOSE J-FET  
DUAL OPERATIONAL AMPLIFIERS  
+
WIDE COMMON-MODE (UP TO V  
) AND  
CC  
DIFFERENTIAL VOLTAGE RANGE  
LOW INPUT BIAS AND OFFSET CURRENT  
OUTPUT SHORT-CIRCUIT PROTECTION  
HIGH INPUT IMPEDANCE J–FET INPUT  
N
DIP8  
(Plastic Package)  
STAGE  
INTERNAL FREQUENCY COMPENSATION  
LATCH UP FREE OPERATION  
HIGH SLEW RATE : 16V/µs (typ)  
D
SO8  
(Plastic Micropackage)  
P
TSSOP8  
(Thin Shrink Small Outline Package)  
ORDER CODE  
Package  
DESCRIPTION  
Temperature  
Range  
Part Number  
N
D
P
The TL082, TL082A and TL082B are high speed  
J–FET input dual operational amplifiers incorpo-  
rating well matched, high voltage J–FET and bipo-  
lar transistors in a monolithic integrated circuit.  
TL082M/AM/BM  
TL082I/AI/BI  
-55°C, +125°C  
-40°C, +105°C  
0°C, +70°C  
TL082C/AC/BC  
Example : TL082CD, TL082IN  
The devices feature high slew rates, low input bias  
and offset current, and low offset voltage temper-  
ature coefficient.  
N = Dual in Line Package (DIP)  
D = Small Outline Package (SO) - also available in Tape & Reel (DT)  
P = Thin Shrink Small Outline Package (TSSOP) - only available in Tape  
& Reel (PT)  
PIN CONNECTIONS (top view)  
1 - Offset null 1  
2 - Inverting input 1  
1
8
7
6
5
3 - Non-inverting input 1  
-
2
-
4 - V  
CC  
5 - Non-inverting input 2  
6 - Inverting input 2  
+
3
4
-
7 - Output 2  
+
+
8 - V  
CC  
March 2002  
1/11  

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