TK10X40D
MOSFETs Silicon N-Channel MOS (π-MOS)
TK10X40D
1. Applications
•
Switching Voltage Regulators
2. Features
(1) Low drain-source on-resistance: RDS(ON) = 0.46 Ω (typ.)
(2) High forward transfer admittance: |Yfs| = 5.0 S (typ.)
(3) Low leakage current: IDSS = 10 µA (max) (VDS = 400 V)
(4) Enhancement mode: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA)
3. Packaging and Internal Circuit
1: Gate (G)
2: N.C.
3: Source (S)
4: Drain (D) (Heatsink)
TFP
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)
Characteristics
Symbol
Rating
Unit
V
Drain-source voltage
Gate-source voltage
Drain current (DC)
Drain current (pulsed)
Power dissipation
VDSS
VGSS
ID
400
±30
(Note 1)
(Note 1)
10
A
IDP
40
(Tc = 25)
PD
125
W
mJ
A
Single-pulse avalanche energy
Avalanche current
(Note 2)
(Note 3)
EAS
IAR
337
10
Repetitive avalanche energy
Channel temperature
EAR
Tch
12.5
150
mJ
Storage temperature
Tstg
-55 to 150
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Start of commercial production
2009-10
2013-12-25
Rev.2.0
1