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TK100F04K3L PDF预览

TK100F04K3L

更新时间: 2024-11-21 20:11:35
品牌 Logo 应用领域
东芝 - TOSHIBA 开关脉冲晶体管
页数 文件大小 规格书
10页 279K
描述
Nch 30V<VDSS≤60V

TK100F04K3L 技术参数

生命周期:Not Recommended包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:unknown风险等级:5.75
雪崩能效等级(Eas):125 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (ID):100 A最大漏源导通电阻:0.0045 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):300 A
参考标准:AEC-Q101表面贴装:YES
端子形式:GULL WING端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

TK100F04K3L 数据手册

 浏览型号TK100F04K3L的Datasheet PDF文件第2页浏览型号TK100F04K3L的Datasheet PDF文件第3页浏览型号TK100F04K3L的Datasheet PDF文件第4页浏览型号TK100F04K3L的Datasheet PDF文件第5页浏览型号TK100F04K3L的Datasheet PDF文件第6页浏览型号TK100F04K3L的Datasheet PDF文件第7页 
TK100F04K3L  
MOSFETs Silicon N-channel MOS (U-MOS)  
TK100F04K3L  
1. Applications  
Switching Voltage Regulators  
DC-DC Converters  
Motor Drivers  
2. Features  
(1) Low drain-source on-resistance: RDS(ON) = 2.5 m(typ.) (VGS = 10 V)  
(2) Low leakage current: IDSS = 10 µA (max) (VDS = 40 V)  
(3) Enhancement mode: Vth = 2.0 to 3.0 V (VDS = 10 V, ID = 1 mA)  
3. Packaging and Internal Circuit  
1: Gate  
2: Drain (Heatsink)  
3: Source  
TO-220SM(W)  
4. Absolute Maximum Ratings (Note) (Ta = 25unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
VDSS  
VGSS  
ID  
40  
±20  
(Note 1)  
(Note 1)  
100  
A
IDP  
300  
(Tc = 25)  
PD  
180  
W
mJ  
A
Single-pulse avalanche energy  
Avalanche current  
(Note 2)  
EAS  
IAR  
125  
100  
Channel temperature  
Storage temperature  
(Note 3)  
(Note 3)  
Tch  
Tstg  
175  
-55 to 175  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2011-09-26  
Rev.1.0  
1

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