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TISP4250J1

更新时间： 2024-11-19 04:49:27
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伯恩斯 - BOURNS /
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14页 277K
描述
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS

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TISP4250J1 数据手册

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TISP4070J1BJ THRU TISP4395J1BJ  
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BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS  
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*R  
A
TISP4xxxJ1BJ Overvoltage Protector Series  
Ground Return Element of Y Configuration  
-2x Current Capability of Y Upper Elements  
-Available in a Wide Range of Voltages  
SMB Package (Top View)  
-Enables Symmetrical and Asymmetrical Y Designs  
-SMB (DO-214AA) Package  
MT1  
MT2  
1
2
Ion-Implanted Breakdown Region  
-Precise and Stable Voltage  
-Low Voltage Overshoot Under Surge  
MD4JAA  
Device Symbol  
VDRM  
V(BO)  
Device  
MT2  
MT1  
V
V
TISP4070J1  
TISP4080J1  
TISP4095J1  
TISP4115J1  
TISP4125J1  
TISP4145J1  
TISP4165J1  
TISP4180J1  
TISP4200J1  
TISP4219J1  
TISP4250J1  
TISP4290J1  
TISP4350J1  
TISP4395J1  
58  
70  
65  
80  
75  
95  
90  
115  
125  
145  
165  
180  
200  
219  
250  
290  
350  
395  
100  
120  
135  
145  
155  
180  
190  
220  
275  
320  
SD4JAA  
Rated for International Surge Wave Shapes  
IPPSM  
Wave Shape  
Standard  
A
2/10  
8/20  
GR-1089-CORE  
IEC 61000-4-5  
1000  
800  
400  
350  
250  
200  
10/160  
10/700  
10/560  
10/1000  
TIA/EIA-IS-968 (FCC Part 68)  
ITU-T K.20/21/45  
TIA/EIA-IS-968 (FCC Part 68)  
GR-1089-CORE  
............................................ UL Recognized Components  
Description  
The TISP4xxxJ1BJ is a symmetrical voltage-triggered bidirectional thyristor device which has been designed as the tail (ground return) element  
of a Y circuit configured protector. As such, the TISP4xxxJ1BJ must be rated to conduct the sum of the TIP and RING currents. For example,  
the normal GR-1089-CORE testing can impose 200 A, 10/1000 and 1000 A, 2/10 on the ground return element of the Y configuration. Using  
the TISP4xxxJ1BJ together with two TISP4xxxH3BJ parts gives a 2x 100 A, 10/1000 Y protector circuit. For ITU-T applications, using the  
TISP4xxxJ1BJ with a TISP3xxxT3BJ gives a coordinated Y protector with a 2x 120 A, 5/310 capability. Design tables are given in the  
Applications Information section. These SMB package combinations are often more space efficient than single package Y protection  
multi-chip integrations.  
These devices allow signal voltages, without clipping, up to the maximum off-state voltage value, VDRM, see Figure 1. Voltages above VDRM are  
limited and will not exceed the breakover voltage, V(BO), level. If sufficient current flows due to the overvoltage, the device switches into a low-  
voltage on-state condition, which diverts the current from the overvoltage through the device. When the diverted current falls below the  
holding current, IH, level the devices switches off and restores normal system operation.  
How to Order  
For Standard  
For Lead Free  
Termination Finish Termination Finish  
Device  
Package  
Carrier  
Order As  
Order As  
TISP4xxxJ1BJ  
BJ (SMB/DO-214AA J-Bend)  
R (Embossed Tape Reeled)  
TISP4xxxJ1BJR  
TISP4xxxJ1BJR-S  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
SEPTEMBER 2001 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
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