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TIM3742-25UL PDF预览

TIM3742-25UL

更新时间: 2024-11-25 03:27:39
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体射频场效应晶体管微波放大器局域网
页数 文件大小 规格书
4页 48K
描述
MICROWAVE POWER GaAs FET

TIM3742-25UL 技术参数

生命周期:Active包装说明:HERMETIC SEALED, 2-16G1B, 3 PIN
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.08
Is Samacsys:N外壳连接:SOURCE
配置:SINGLE最小漏源击穿电压:15 V
最大漏极电流 (Abs) (ID):20 A最大漏极电流 (ID):20 A
FET 技术:METAL-OXIDE SEMICONDUCTOR最高频带:C BAND
JESD-30 代码:R-CDFM-F2元件数量:1
端子数量:2工作模式:DEPLETION MODE
最高工作温度:175 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL功耗环境最大值:100 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子形式:FLAT
端子位置:DUAL晶体管应用:AMPLIFIER
晶体管元件材料:GALLIUM ARSENIDEBase Number Matches:1

TIM3742-25UL 数据手册

 浏览型号TIM3742-25UL的Datasheet PDF文件第2页浏览型号TIM3742-25UL的Datasheet PDF文件第3页浏览型号TIM3742-25UL的Datasheet PDF文件第4页 
MICROWAVE POWER GaAs FET  
MICROWAVE SEMICONDUCTOR  
TIM3742-25UL  
TECHNICAL DATA  
FEATURES  
n HIGH POWER  
P1dB=44.5dBm at 3.7GHz to 4.2GHz  
n HIGH GAIN  
nBROADBANDINTERNALLYMATCHEDFET  
n HERMETICALLY SEALED PACKAGE  
G1dB=10.5dB at 3.7GHz to 4.2GHz  
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 C )  
°
CHARACTERISTICS  
Output Power at 1dB Gain  
Compression Point  
Power Gain at 1dB Gain  
Compression Point  
Drain Current  
SYMBOL  
CONDITIONS  
UNIT MIN. TYP. MAX.  
P
1dB  
dBm 43.5 44.5  
¾
G1dB  
dB  
9.5  
10.5  
¾
VDS= 10V  
f = 3.7 to 4.2GHz  
IDS1  
DG  
A
dB  
%
6.8  
¾
7.6  
±0.6  
¾
¾
¾
Gain Flatness  
Power Added Efficiency  
3rd Order Intermodulation  
Distortion  
hadd  
IM3  
38  
-47  
¾
Two-Tone Test  
Po=33.5dBm  
dBc  
-44  
¾
(Single Carrier Level)  
(VDS X IDS + Pin – P1dB)  
X Rth(c-c)  
Drain Current  
IDS2  
A
¾
¾
6.8  
7.6  
80  
Channel Temperature Rise  
DTch  
C
°
¾
Recommended gate resistance(Rg) : Rg= 28 W(MAX.)  
ELECTRICAL CHARACTERISTICS ( Ta= 25 C )  
°
CHARACTERISTICS  
SYMBOL  
CONDITIONS  
VDS= 3V  
IDS= 8.0A  
UNIT MIN. TYP. MAX.  
Transconductance  
gm  
mS  
5000  
-2.5  
14.4  
¾
¾
¾
Pinch-off Voltage  
VGSoff VDS= 3V  
IDS= 80mA  
V
-1.0  
-4.0  
Saturated Drain Current  
IDSS  
VDS= 3V  
VGS= 0V  
A
¾
¾
¾
Gate-Source Breakdown  
Voltage  
V
GSO  
IGS= -280 A  
V
-5  
m
Thermal Resistance  
Rth(c-c) Channel to Case  
C/W  
°
1.2  
1.5  
¾
u The information contained herein is presented only as a guide for the applications of our products. No responsibility is  
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,  
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.  
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA  
before proceeding with design of equipment incorporating this product.  
Rev. Jun. 2006  

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