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TIM3742-16SL-341 PDF预览

TIM3742-16SL-341

更新时间: 2024-11-28 03:27:39
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体射频场效应晶体管微波放大器局域网
页数 文件大小 规格书
4页 73K
描述
MICROWAVE POWER GaAs FET

TIM3742-16SL-341 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete包装说明:FLANGE MOUNT, R-CDFM-F2
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.63
Is Samacsys:N外壳连接:SOURCE
配置:SINGLE最小漏源击穿电压:15 V
最大漏极电流 (Abs) (ID):14 A最大漏极电流 (ID):13 A
FET 技术:METAL-OXIDE SEMICONDUCTOR最高频带:S BAND
JESD-30 代码:R-CDFM-F2元件数量:1
端子数量:2工作模式:DEPLETION MODE
最高工作温度:175 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):240极性/信道类型:N-CHANNEL
功耗环境最大值:75 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:AMPLIFIER
晶体管元件材料:GALLIUM ARSENIDEBase Number Matches:1

TIM3742-16SL-341 数据手册

 浏览型号TIM3742-16SL-341的Datasheet PDF文件第2页浏览型号TIM3742-16SL-341的Datasheet PDF文件第3页浏览型号TIM3742-16SL-341的Datasheet PDF文件第4页 
MICROWAVE POWER GaAs FET  
MICROWAVE SEMICONDUCTOR  
TIM3742-16SL-341  
TECHNICAL DATA  
FEATURES  
„ LOW INTERMODULATION DISTORTION  
IM3=-45 dBc at Pout= 31.5dBm  
Single Carrier Level  
„ HIGH GAIN  
G1dB=10.0dB at 3.3GHz to 3.6GHz  
„ BROAD BAND INTERNALLY MATCHED FET  
„ HERMETICALLY SEALED PACKAGE  
„ HIGH POWER  
P1dB=42.5dBm at 3.3GHz to 3.6GHz  
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 C )  
°
CHARACTERISTICS  
Output Power at 1dB Gain  
Compression Point  
Power Gain at 1dB Gain  
Compression Point  
Drain Current  
SYMBOL  
CONDITIONS  
UNIT MIN. TYP. MAX.  
P1dB  
dBm 41.5 42.5  
G1dB  
dB  
10.0  
VDS= 10V  
f= 3.3 to 3.6GHz  
IDS1  
G  
A
dB  
%
4.4  
5.0  
±0.8  
Gain Flatness  
36  
Power Added Efficiency  
3rd Order Intermodulation  
Distortion  
ηadd  
IM3  
Two-Tone Test  
Po=31.5dBm  
dBc  
-42  
-45  
(Single Carrier Level)  
(VDS X IDS + Pin – P1dB)  
X Rth(c-c)  
Drain Current  
IDS2  
A
4.4  
5.0  
80  
C
°
Channel Temperature Rise  
Tch  
Recommended Gate Resistance(Rg): 100 (Max.)  
ELECTRICAL CHARACTERISTICS ( Ta= 25 C )  
°
CHARACTERISTICS  
SYMBOL  
CONDITIONS  
VDS= 3V  
UNIT MIN. TYP. MAX.  
Transconductance  
gm  
mS  
3200  
-2.5  
10.0  
-1.0  
-4.0  
IDS= 5.2A  
VDS= 3V  
IDS= 70mA  
VDS= 3V  
Pinch-off Voltage  
VGSoff  
IDSS  
V
Saturated Drain Current  
A
VGS= 0V  
Gate-Source Breakdown  
Voltage  
VGSO  
Rth(c-c)  
IGS= -210µA  
V
-5  
C/W  
°
Thermal Resistance  
Channel to Case  
1.4  
2.0  
‹ The information contained herein is presented only as a guide for the applications of our products. No responsibility is  
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,  
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.  
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA  
before proceeding with design of equipment incorporating this product.  
Rev. Jul., 2005  

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