Datasheet > 可编程逻辑 > 可编程逻辑器件> TIBPAL16R8-5C

TIBPAL16R8-5C

更新时间： 2024-11-02 22:42:19

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
30页	292K
描述
HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

TIBPAL16R8-5C 数据手册

TIBPAL16L8-5C, TIBPAL16R4-5C, TIBPAL16R6-5C, TIBPAL16R8-5C

TIBPAL16L8-7M, TIBPAL16R4-7M, TIBPAL16R6-7M, TIBPAL16R8-7M

HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS

SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992

TIBPAL16L8’

C SUFFIX . . . J OR N PACKAGE

M SUFFIX . . . J PACKAGE

•

High-Performance Operation:

(no feedback)

TIBPAL16R’ -5C Series . . . 125 MHz Min

TIBPAL16R’ -7M Series . . . 100 MHz Min

(internal feedback)

TIBPAL16R’ -5C Series . . . 125 MHz Min

TIBPAL16R’ -7M Series . . . 100 MHz Min

max

(TOP VIEW)

max

I/O

(external feedback)

max

17 I/O

16 I/O

15 I/O

14 I/O

13 I/O

TIBPAL16R’ -5C Series . . . 117 MHz Min

TIBPAL16R’ -7M Series . . . 74 MHz Min

Propagation Delay

TIBPAL16L8-5C Series . . . 5 ns Max

TIBPAL16L8-7M Series . . . 7 ns Max

TIBPAL16R’ -5C Series

GND

(CLK-to-Q) . . . 4 ns Max

TIBPAL16R ’ -7M Series

(CLK-to-Q) . . . 6.5 ns Max

•

Functionally Equivalent, but Faster than,

Existing 20-Pin PLDs

TIBPAL16L8’

C SUFFIX . . . FN PACKAGE

M SUFFIX . . . FK PACKAGE

Preload Capability on Output Registers

Simplifies Testing

(TOP VIEW)

Power-Up Clear on Registered Devices (All

Levels at the Output Pins Go High)

•

Package Options Include Both Plastic and

Ceramic Chip Carriers in Addition to Plastic

and Ceramic DIPs

20 19

I/O

Security Fuse Prevents Duplication

I/O

PORT

9 10 11 12 13

3-STATE

REGISTERED

Q OUTPUTS

DEVICE

INPUTS O OUTPUTS

’PAL16L8

’PAL16R4

’PAL16R6

’PAL16R8

4 (3-state buffers)

6 (3-state buffers)

8 (3-state buffers)

Pin assignments in operating mode

description

These programmable array logic devices feature high speed and functional equivalency when compared with

currently available devices. These IMPACT-X circuits combine the latest Advanced Low-Power Schottky

technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for

conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically

results in a more compact circuit board.

The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for

operation over the full military temperature range of –55°C to 125°C.

These devices are covered by U.S. Patent 4,410,987.

IMPACT-X is a trademark of Texas Instruments Incorporated.

PAL is a registered trademark of Advanced Micro Devices Inc.

This documentcontains informationonproducts inmore thanone phase

of development. The status of each device is indicated on the page(s)

specifying its electrical characteristics.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

12 3 4 5 6 7...30

中文翻译

下载PDF

与TIBPAL16R8-5C相关器件

型号	品牌	获取价格	描述	数据表
TIBPAL16R8-5CFN	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R8-5CJ	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R8-5CN	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R8-7C	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R8-7CFN	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R8-7CJ	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R8-7CN	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R8-7M	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R8-7MFK	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R8-7MFKB	TI	获取价格	HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS

与TIBPAL16R8-5C相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

8
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

4
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

26
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

25

产品中心

服务支持

精选活动

关于我们

帮助中心

TIBPAL16R8-5C

TIBPAL16R8-5C 数据手册

与TIBPAL16R8-5C相关器件

与TIBPAL16R8-5C相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

TIBPAL16R8-5C

TIBPAL16R8-5C 数据手册

与TIBPAL16R8-5C相关器件

与TIBPAL16R8-5C相关文章

您还可以找

您在本页遇到什么问题？