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TIBPAL16R8-10C

更新时间： 2024-11-02 22:24:35
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
23页 232K
描述
HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS

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TIBPAL16R8-10C 数据手册

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TIBPAL16L8-10C, TIBPAL16R4-10C, TIBPAL16R6-10C, TIBPAL16R8-10C  
TIBPAL16L8-12M, TIBPAL16R4-12M, TIBPAL16R6-12M, TIBPAL16R8-12M  
HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS  
SRPS017 – D3023, MAY 1987 – REVISED MARCH 1992  
TIBPAL16L8’  
C SUFFIX . . . J OR N PACKAGE  
M SUFFIX . . . J PACKAGE  
•
High-Performance Operation:  
f
(w/o feedback)  
max  
TIBPAL16R’-10C Series . . . 62.5 MHz Min  
TIBPAL16R’-12M Series . . . 56 MHz Min  
(TOP VIEW)  
f
(with feedback)  
TIBPAL16R’-10C Series . . . 55.5 MHz Min  
TIBPAL16R’-12M Series . . . 48 MHz Min  
max  
I
I
I
I
I
I
I
I
I
V
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
CC  
O
I/O  
Propagation Delay  
17 I/O  
16 I/O  
15 I/O  
14 I/O  
13 I/O  
TIBPAL16L’-10C Series . . . 10 ns Max  
TIBPAL16L’-12M Series . . . 12 ns Max  
•
•
•
Functionally Equivalent, but Faster than,  
Existing 20-Pin PLDs  
12  
11  
O
I
Preload Capability on Output Registers  
Simplifies Testing  
GND  
Power-Up Clear on Registered Devices (All  
Register Outputs are Set Low, but Voltage  
Levels at the Output Pins Go High)  
TIBPAL16L8’  
C SUFFIX . . . FN PACKAGE  
M SUFFIX . . . FK PACKAGE  
•
Package Options Include Both Plastic and  
Ceramic Chip Carriers in Addition to Plastic  
and Ceramic DIPs  
(TOP VIEW)  
•
•
Security Fuse Prevents Duplication  
3
2
1
20 19  
18  
I/O  
I/O  
I/O  
I/O  
I/O  
I
I
I
I
I
4
5
6
7
8
Dependable Texas Instruments Quality and  
Reliability  
17  
16  
15  
14  
I/O  
PORT  
S
I
3-STATE  
REGISTERED  
Q OUTPUTS  
DEVICE  
INPUTS O OUTPUTS  
9 10 11 12 13  
PAL16L8  
PAL16R4  
PAL16R6  
PAL16R8  
10  
8
2
0
0
0
0
6
4
2
0
4 (3-state buffers)  
6 (3-state buffers)  
8 (3-state buffers)  
8
8
Pin assignments in operating mode  
description  
These programmable array logic devices feature high speed and functional equivalency when compared with  
currently available devices. These IMPACT-X circuits combine the latest Advanced Low-Power Schottky  
technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for  
conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically  
results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board  
space.  
Alloftheregisteroutputsaresettoalowlevelduringpower up. Extracircuitryhasbeenprovidedtoallowloading  
of each register asynchronously to either a high or low state. This feature simplifies testing because the registers  
can be set to an initial state prior to executing the test sequence.  
The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for  
operation over the full military temperature range of –55°C to 125°C.  
These devices are covered by U.S. Patent 4,410,987.  
IMPACT-X is a trademark of Texas Instruments Incorporated.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
PRODUCTION DATA information is current as of publication date.  
Copyright 1992, Texas Instruments Incorporated  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
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