是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.91 | Is Samacsys: | N |
架构: | PAL-TYPE | JESD-30 代码: | S-XQCC-N20 |
输入次数: | 10 | 输出次数: | 6 |
产品条款数: | 64 | 端子数量: | 20 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
输出函数: | REGISTERED | 封装主体材料: | CERAMIC |
封装代码: | QCCN | 封装等效代码: | LCC20,.35SQ |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 5 V |
可编程逻辑类型: | EE PLD | 认证状态: | Not Qualified |
筛选级别: | 38535Q/M;38534H;883B | 子类别: | Programmable Logic Devices |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | TTL | 温度等级: | MILITARY |
端子形式: | NO LEAD | 端子节距: | 1.27 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TIBPAL16R6-20MFK | TI |
获取价格 |
OT PLD, 20ns, CQCC20, CERAMIC, CC-20 | |
TIBPAL16R6-20MFKB | TI |
获取价格 |
HIGH-PERFORMANCE IMPACT PAL CIRCUITS | |
TIBPAL16R6-20MJ | TI |
获取价格 |
HIGH-PERFORMANCE IMPACT PAL CIRCUITS | |
TIBPAL16R6-20MJB | TI |
获取价格 |
HIGH-PERFORMANCE IMPACT PAL CIRCUITS | |
TIBPAL16R6-20MW | TI |
获取价格 |
OT PLD, 20ns, CDFP20, CERAMIC, DFP-20 | |
TIBPAL16R6-20MWB | TI |
获取价格 |
HIGH-PERFORMANCE IMPACT PAL CIRCUITS | |
TIBPAL16R6-25C | TI |
获取价格 |
LOW-POWER HIGH-PERFORMANCE IMPACT E PAL CIRCUITS | |
TIBPAL16R6-25CFN | TI |
获取价格 |
LOW-POWER HIGH-PERFORMANCE IMPACT E PAL CIRCUITS | |
TIBPAL16R6-25CFNR | TI |
获取价格 |
暂无描述 | |
TIBPAL16R6-25CJ | TI |
获取价格 |
LOW-POWER HIGH-PERFORMANCE IMPACT E PAL CIRCUITS |