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TIBPAL16R6-10MFKB PDF预览

TIBPAL16R6-10MFKB

更新时间： 2024-11-23 22:24:39
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
23页 238K
描述
HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS

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TIBPAL16R6-10MFKB 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Obsolete零件包装代码：QLCC
包装说明：QCCN, LCC20,.35SQ针数：20
Reach Compliance Code：not_compliantECCN代码：3A001.A.2.C
HTS代码：8542.39.00.01风险等级：5.92
架构：PAL-TYPE最大时钟频率：52.5 MHz
JESD-30 代码：S-CQCC-N20长度：8.89 mm
专用输入次数：8I/O 线路数量：2
输入次数：10输出次数：6
产品条款数：64端子数量：20
最高工作温度：125 °C最低工作温度：-55 °C
组织：8 DEDICATED INPUTS, 2 I/O输出函数：MIXED
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装代码：QCCN
封装等效代码：LCC20,.35SQ封装形状：SQUARE
封装形式：CHIP CARRIER峰值回流温度（摄氏度）：NOT SPECIFIED
电源：5 V可编程逻辑类型：OT PLD
传播延迟：12 ns认证状态：Not Qualified
筛选级别：MIL-PRF-38535座面最大高度：2.03 mm
子类别：Programmable Logic Devices最大供电电压：5.5 V
最小供电电压：4.5 V标称供电电压：5 V
表面贴装：YES技术：TTL
温度等级：MILITARY端子形式：NO LEAD
端子节距：1.27 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：8.89 mm
Base Number Matches：1

TIBPAL16R6-10MFKB 数据手册

 浏览型号TIBPAL16R6-10MFKB的Datasheet PDF文件第2页浏览型号TIBPAL16R6-10MFKB的Datasheet PDF文件第3页浏览型号TIBPAL16R6-10MFKB的Datasheet PDF文件第4页浏览型号TIBPAL16R6-10MFKB的Datasheet PDF文件第5页浏览型号TIBPAL16R6-10MFKB的Datasheet PDF文件第6页浏览型号TIBPAL16R6-10MFKB的Datasheet PDF文件第7页 
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C  
TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M  
HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS  
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992  
TIBPAL16L8’  
C SUFFIX . . . J OR N PACKAGE  
M SUFFIX . . . J PACKAGE  
•
High-Performance Operation:  
f
f
f
(no feedback)  
TIBPAL16R’-7C Series . . . 100 MHz Min  
TIBPAL16R’-10M Series . . . 62.5 MHz Min  
(internal feedback)  
TIBPAL16R’-7C Series . . . 100 MHz Min  
TIBPAL16R’-10M Series . . . 62.5 MHz Min  
max  
(TOP VIEW)  
max  
I
I
I
I
I
I
I
I
I
V
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
CC  
O
I/O  
(external feedback)  
max  
17 I/O  
16 I/O  
15 I/O  
14 I/O  
13 I/O  
TIBPAL16R’-7C Series . . . 74 MHz Min  
TIBPAL16R’-10M Series . . . 52.5 MHz Min  
Propagation Delay  
TIBPAL16L’-7C Series . . . 7 ns Max  
TIBPAL16L’-10M Series . . . 10 ns Max  
12  
11  
O
I
•
•
•
Functionally Equivalent, but Faster than,  
Existing 20-Pin PLDs  
GND  
Preload Capability on Output Registers  
Simplifies Testing  
TIBPAL16L8’  
C SUFFIX . . . FN PACKAGE  
M SUFFIX . . . FK PACKAGE  
Power-Up Clear on Registered Devices (All  
Register Outputs are Set Low, but Voltage  
Levels at the Output Pins Go High)  
(TOP VIEW)  
•
Package Options Include Both Plastic and  
Ceramic Chip Carriers in Addition to Plastic  
and Ceramic DIPs  
3
2
1
20 19  
18  
I/O  
I/O  
I/O  
I/O  
I/O  
I
I
I
I
I
4
5
6
7
8
17  
16  
15  
14  
•
•
Security Fuse Prevents Duplication  
Dependable Texas Instruments Quality and  
Reliability  
9 10 11 12 13  
I/O  
PORT  
S
I
3-STATE  
REGISTERED  
Q OUTPUTS  
DEVICE  
INPUTS O OUTPUTS  
PAL16L8  
PAL16R4  
PAL16R6  
PAL16R8  
10  
8
2
0
0
0
0
6
4
2
0
4 (3-state buffers)  
6 (3-state buffers)  
8 (3-state buffers)  
Pin assignments in operating mode  
8
8
description  
These programmable array logic devices feature high speed and functional equivalency when compared with  
currently available devices. These IMPACT-X circuits combine the latest Advanced Low-Power Schottky  
technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for  
conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically  
results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board  
space.  
Alloftheregisteroutputsaresettoalowlevelduringpower-up. Extracircuitryhasbeenprovidedtoallowloading  
of each register asynchronously to either a high or low state. This feature simplifies testing because the registers  
can be set to an initial state prior to executing the test sequence.  
The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for  
operation over the full military temperature range of –55°C to 125°C.  
These devices are covered by U.S. Patent 4,410,987.  
IMPACT-X is a trademark of Texas Instruments Incorporated.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
PRODUCTION DATA information is current as of publication date.  
Copyright 1992, Texas Instruments Incorporated  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1
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