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TIBPAL16R4-15MW

更新时间： 2024-11-02 22:34:47
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
13页 250K
描述
HIGH-PERFORMANCE IMPACT E PAL CIRCUITS

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中文翻译

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TIBPAL16R4-15MW 技术参数

生命周期：Obsolete零件包装代码：DFP
包装说明：DFP,针数：20
Reach Compliance Code：unknownECCN代码：3A001.A.2.C
HTS代码：8542.39.00.01风险等级：5.72
其他特性：POWER-UP RESET最大时钟频率：50 MHz
JESD-30 代码：R-GDFP-F20专用输入次数：8
I/O 线路数量：4端子数量：20
最高工作温度：125 °C最低工作温度：-55 °C
组织：8 DEDICATED INPUTS, 4 I/O输出函数：MIXED
封装主体材料：CERAMIC, GLASS-SEALED封装代码：DFP
封装形状：RECTANGULAR封装形式：FLATPACK
可编程逻辑类型：OT PLD传播延迟：15 ns
认证状态：Not Qualified最大供电电压：5.5 V
最小供电电压：4.5 V标称供电电压：5 V
表面贴装：YES技术：TTL
温度等级：MILITARY端子形式：FLAT
端子位置：DUALBase Number Matches：1

TIBPAL16R4-15MW 数据手册

 浏览型号TIBPAL16R4-15MW的Datasheet PDF文件第2页浏览型号TIBPAL16R4-15MW的Datasheet PDF文件第3页浏览型号TIBPAL16R4-15MW的Datasheet PDF文件第4页浏览型号TIBPAL16R4-15MW的Datasheet PDF文件第5页浏览型号TIBPAL16R4-15MW的Datasheet PDF文件第6页浏览型号TIBPAL16R4-15MW的Datasheet PDF文件第7页 
TIBPAL16L8-15M, TIBPAL16R4-15M, TIBPAL16R6-15M, TIBPAL16R8-15M  
HIGH-PERFORMANCE IMPACT PAL CIRCUITS  
SRPS018A – D3338, JANUARY 1986 – REVISED MAY 1996  
TIBPAL16L8’  
J OR W PACKAGE  
High-Performance Operation:  
Propagation Delay . . . 15 ns Max  
(TOP VIEW)  
Power-Up Clear on Registered Devices (All  
Register Outputs are Set High, but Voltage  
Levels at the Output Pins Go Low)  
I
I
I
I
I
I
I
I
I
V
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
CC  
O
I/O  
Package Options Include Ceramic Flat (W)  
Packages, Ceramic Chip Carriers (FK), and  
Ceramic (J) 300-mil DIPs  
17 I/O  
16 I/O  
15 I/O  
14 I/O  
13 I/O  
Dependable Texas Instruments Quality and  
Reliability  
I
3-STATE  
REGISTERED  
Q OUTPUTS  
I/O  
PORTS  
DEVICE  
INPUTS O OUTPUTS  
12  
11  
O
I
PAL16L8  
PAL16R4  
PAL16R6  
PAL16R8  
10  
8
2
0
0
0
0
6
4
2
0
GND  
4 (3-state buffers)  
6 (3-state buffers)  
8 (3-state buffers)  
8
TIBPAL16L8’  
FK PACKAGE  
8
(TOP VIEW)  
description  
These programmable array logic devices feature  
high speed and functional equivalency when  
compared with currently available devices. These  
IMPACT-X circuits combine the latest Advanced  
Low-Power Schottky technology with proven  
titanium-tungsten fuses to provide reliable,  
high-performance substitutes for conventional  
TTL logic. Their easy programmability allows for  
quick design of custom functions and typically  
results in a more compact circuit board. In  
addition, chip carriers are available for futher  
reduction in board space.  
3
2 1 20 19  
I/O  
I/O  
I/O  
I/O  
I/O  
I
I
I
I
I
18  
17  
16  
15  
14  
4
5
6
7
8
9 10 11 12 13  
Pin assignments in operating mode  
The TIBPAL16’ M series is characterized for  
operation over the full military temperature range  
of –55°C to 125°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
IMPACT is a trademark of Texas Instruments Incorporated.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
Copyright 1996, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...13

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