5秒后页面跳转
捷配首页

Datasheet > 可编程逻辑 > 可编程逻辑器件> TIBPAL16R4-15MFKB
TIBPAL16R4-15MFKB PDF预览

TIBPAL16R4-15MFKB

更新时间： 2024-11-03 13:14:39
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
17页 289K
描述
High-Performance Impact PAL Circuits 20-LCCC -55 to 125

阅读下载

中文翻译

获取价格

TIBPAL16R4-15MFKB 技术参数

生命周期：Not Recommended零件包装代码：QLCC
包装说明：QCCN, LCC20,.35SQ针数：20
Reach Compliance Code：not_compliantECCN代码：3A001.A.2.C
HTS代码：8542.39.00.01风险等级：5.25
Is Samacsys：N架构：PAL-TYPE
最大时钟频率：50 MHz系统内可编程：NO
JESD-30 代码：S-CQCC-N20JTAG BST：NO
长度：8.89 mm专用输入次数：8
I/O 线路数量：4输入次数：12
输出次数：8产品条款数：64
端子数量：20最高工作温度：125 °C
最低工作温度：-55 °C组织：8 DEDICATED INPUTS, 4 I/O
输出函数：MIXED封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装代码：QCCN封装等效代码：LCC20,.35SQ
封装形状：SQUARE封装形式：CHIP CARRIER
包装方法：TUBE峰值回流温度（摄氏度）：NOT SPECIFIED
电源：5 V可编程逻辑类型：OT PLD
传播延迟：15 ns认证状态：Not Qualified
筛选级别：MIL-PRF-38535座面最大高度：2.03 mm
子类别：Programmable Logic Devices最大供电电压：5.5 V
最小供电电压：4.5 V标称供电电压：5 V
表面贴装：YES技术：TTL
温度等级：MILITARY端子形式：NO LEAD
端子节距：1.27 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：8.89 mm
Base Number Matches：1

TIBPAL16R4-15MFKB 数据手册

 浏览型号TIBPAL16R4-15MFKB的Datasheet PDF文件第2页浏览型号TIBPAL16R4-15MFKB的Datasheet PDF文件第3页浏览型号TIBPAL16R4-15MFKB的Datasheet PDF文件第4页浏览型号TIBPAL16R4-15MFKB的Datasheet PDF文件第5页浏览型号TIBPAL16R4-15MFKB的Datasheet PDF文件第6页浏览型号TIBPAL16R4-15MFKB的Datasheet PDF文件第7页 
TIBPAL 16L8-15C, TIBPAL 16R4-15C, TIBPAL 16R6-15C, TIBPAL 16R8-15C  
TIBPAL 16L8-20M, TIBPAL 16R4-20M, TIBPAL 16R6-20M, TIBPAL 16R8-20M  
HIGH-PERFORMANCE IMPACT PAL CIRCUITS  
SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000  
TIBPAL16L8’  
High-Performance Operation:  
Propagation Delay  
C SUFFIX . . . J OR N PACKAGE  
M SUFFIX . . . J OR W PACKAGE  
(TOP VIEW)  
C Suffix . . . 15 ns Max  
M Suffix . . . 20 ns Max  
Functionally Equivalent, but Faster Than  
PAL16L8A, PAL16R4A, PAL16R6A, and  
PAL16R8A  
I
V
CC  
O
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
I
I
I/O  
I/O  
I
Power-Up Clear on Registered Devices (All  
Register Outputs Are Set High, but Voltage  
Levels at the Output Pins Go Low)  
I
16 I/O  
15  
14  
13  
12  
11  
I
I/O  
I/O  
I/O  
O
I
Package Options Include Both Plastic and  
Ceramic Chip Carriers in Addition to  
Plastic and Ceramic DIPs  
I
I
GND  
I
Dependable Texas Instruments Quality and  
Reliability  
TIBPAL16L8’  
3-STATE  
O
OUTPUTS  
REGISTERED  
Q
OUTPUTS  
C SUFFIX . . . FN PACKAGE  
M SUFFIX . . . FK PACKAGE  
(TOP VIEW)  
I
I/O  
PORTS  
DEVICE  
INPUTS  
PAL16L8  
PAL16R4  
10  
8
2
0
6
4
4 (3-state  
buffers)  
0
3
2
1 20 19  
18  
6 (3-state  
buffers)  
I/O  
I/O  
I/O  
I/O  
I/O  
I
I
I
I
I
4
5
6
7
8
PAL16R6  
PAL16R8  
8
8
0
0
2
0
17  
16  
15  
14  
8 (3-state  
buffers)  
9 10 11 12 13  
description  
These programmable array logic devices feature  
high speed and functional equivalency when  
compared with currently available devices. These  
IMPACT circuits combine the latest Advanced  
Low-Power Schottky technology with proven  
titanium-tungsten fuses to provide reliable,  
high-performance substitutes for conventional  
TTL logic. Their easy programmability allows for  
quick design of custom functions and typically  
results in a more compact circuit board. In  
addition, chip carriers are available for further  
reduction in board space.  
The TIBPAL16’ C series is characterized from 0°C  
to 75°C. The TIBPAL16’ M series is characterized  
for operation over the full military temperature  
range of –55°C to 125°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
These devices are covered by U.S. Patent 4,410,987.  
IMPACT is a trademark of Texas Instruments.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
Copyright 2000, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...17

中文翻译

下载PDF

与TIBPAL16R4-15MFKB相关器件

型号 品牌 获取价格 描述 数据表
TIBPAL16R4-15MJ TI

获取价格

 		HIGH-PERFORMANCE IMPACT E PAL CIRCUITS
TIBPAL16R4-15MJB TI

获取价格

 		High-Performance Impact PAL Circuits 20-CDIP -55 to 125
TIBPAL16R4-15MW TI

获取价格

 		HIGH-PERFORMANCE IMPACT E PAL CIRCUITS
TIBPAL16R4-15MWB TI

获取价格

 		High-Performance Impact PAL Circuits 20-CFP -55 to 125
TIBPAL16R4-20M TI

获取价格

 		HIGH-PERFORMANCE IMPACT PAL CIRCUITS
TIBPAL16R4-20MFH TI

获取价格

 		暂无描述
TIBPAL16R4-20MFKB TI

获取价格

 		HIGH-PERFORMANCE IMPACT PAL CIRCUITS
TIBPAL16R4-20MJ TI

获取价格

 		HIGH-PERFORMANCE IMPACT PAL CIRCUITS
TIBPAL16R4-20MJB TI

获取价格

 		HIGH-PERFORMANCE IMPACT PAL CIRCUITS
TIBPAL16R4-20MW TI

获取价格

 		暂无描述

与TIBPAL16R4-15MFKB相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证