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TIBPAL16L8-20MW PDF预览

TIBPAL16L8-20MW

更新时间： 2024-11-03 21:20:19
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
17页 283K
描述
OT PLD, 20ns, CDFP20, CERAMIC, DFP-20

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TIBPAL16L8-20MW 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：DFP包装说明：DFP, FL20,.3
针数：20Reach Compliance Code：not_compliant
ECCN代码：3A001.A.2.CHTS代码：8542.39.00.01
风险等级：5.73架构：PAL-TYPE
JESD-30 代码：R-GDFP-F20专用输入次数：10
I/O 线路数量：6输入次数：16
输出次数：8产品条款数：64
端子数量：20最高工作温度：125 °C
最低工作温度：-55 °C组织：10 DEDICATED INPUTS, 6 I/O
输出函数：COMBINATORIAL封装主体材料：CERAMIC, GLASS-SEALED
封装代码：DFP封装等效代码：FL20,.3
封装形状：RECTANGULAR封装形式：FLATPACK
峰值回流温度（摄氏度）：NOT SPECIFIED电源：5 V
可编程逻辑类型：OT PLD传播延迟：20 ns
认证状态：Not Qualified子类别：Programmable Logic Devices
最大供电电压：5.5 V最小供电电压：4.5 V
标称供电电压：5 V表面贴装：YES
技术：TTL温度等级：MILITARY
端子形式：FLAT端子节距：1.27 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

TIBPAL16L8-20MW 数据手册

 浏览型号TIBPAL16L8-20MW的Datasheet PDF文件第2页浏览型号TIBPAL16L8-20MW的Datasheet PDF文件第3页浏览型号TIBPAL16L8-20MW的Datasheet PDF文件第4页浏览型号TIBPAL16L8-20MW的Datasheet PDF文件第5页浏览型号TIBPAL16L8-20MW的Datasheet PDF文件第6页浏览型号TIBPAL16L8-20MW的Datasheet PDF文件第7页 
TIBPAL 16L8-15C, TIBPAL 16R4-15C, TIBPAL 16R6-15C, TIBPAL 16R8-15C  
TIBPAL 16L8-20M, TIBPAL 16R4-20M, TIBPAL 16R6-20M, TIBPAL 16R8-20M  
HIGH-PERFORMANCE IMPACT PAL CIRCUITS  
SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000  
TIBPAL16L8’  
High-Performance Operation:  
Propagation Delay  
C SUFFIX . . . J OR N PACKAGE  
M SUFFIX . . . J OR W PACKAGE  
(TOP VIEW)  
C Suffix . . . 15 ns Max  
M Suffix . . . 20 ns Max  
Functionally Equivalent, but Faster Than  
PAL16L8A, PAL16R4A, PAL16R6A, and  
PAL16R8A  
I
V
CC  
O
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
I
I
I/O  
I/O  
I
Power-Up Clear on Registered Devices (All  
Register Outputs Are Set High, but Voltage  
Levels at the Output Pins Go Low)  
I
16 I/O  
15  
14  
13  
12  
11  
I
I/O  
I/O  
I/O  
O
I
Package Options Include Both Plastic and  
Ceramic Chip Carriers in Addition to  
Plastic and Ceramic DIPs  
I
I
GND  
I
Dependable Texas Instruments Quality and  
Reliability  
TIBPAL16L8’  
3-STATE  
O
OUTPUTS  
REGISTERED  
Q
OUTPUTS  
C SUFFIX . . . FN PACKAGE  
M SUFFIX . . . FK PACKAGE  
(TOP VIEW)  
I
I/O  
PORTS  
DEVICE  
INPUTS  
PAL16L8  
PAL16R4  
10  
8
2
0
6
4
4 (3-state  
buffers)  
0
3
2
1 20 19  
18  
6 (3-state  
buffers)  
I/O  
I/O  
I/O  
I/O  
I/O  
I
I
I
I
I
4
5
6
7
8
PAL16R6  
PAL16R8  
8
8
0
0
2
0
17  
16  
15  
14  
8 (3-state  
buffers)  
9 10 11 12 13  
description  
These programmable array logic devices feature  
high speed and functional equivalency when  
compared with currently available devices. These  
IMPACT circuits combine the latest Advanced  
Low-Power Schottky technology with proven  
titanium-tungsten fuses to provide reliable,  
high-performance substitutes for conventional  
TTL logic. Their easy programmability allows for  
quick design of custom functions and typically  
results in a more compact circuit board. In  
addition, chip carriers are available for further  
reduction in board space.  
The TIBPAL16’ C series is characterized from 0°C  
to 75°C. The TIBPAL16’ M series is characterized  
for operation over the full military temperature  
range of –55°C to 125°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
These devices are covered by U.S. Patent 4,410,987.  
IMPACT is a trademark of Texas Instruments.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
Copyright 2000, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...17

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