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TIBPAL16L8-15MWB PDF预览

TIBPAL16L8-15MWB

更新时间: 2024-11-03 21:06:47
品牌 Logo 应用领域
德州仪器 - TI 时钟输入元件可编程逻辑
页数 文件大小 规格书
18页 437K
描述
High-Performance Impact PAL Circuits 20-CFP -55 to 125

TIBPAL16L8-15MWB 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DFP包装说明:DFP, FL20,.3
针数:20Reach Compliance Code:not_compliant
ECCN代码:3A001.A.2.CHTS代码:8542.39.00.01
Factory Lead Time:1 week风险等级:5.55
架构:PAL-TYPE最大时钟频率:50 MHz
JESD-30 代码:R-GDFP-F20专用输入次数:10
I/O 线路数量:6输入次数:16
输出次数:8产品条款数:64
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C组织:10 DEDICATED INPUTS, 6 I/O
输出函数:COMBINATORIAL封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DFP封装等效代码:FL20,.3
封装形状:RECTANGULAR封装形式:FLATPACK
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
可编程逻辑类型:OT PLD传播延迟:15 ns
认证状态:Not Qualified筛选级别:MIL-PRF-38535
座面最大高度:2.45 mm子类别:Programmable Logic Devices
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V表面贴装:YES
技术:TTL温度等级:MILITARY
端子形式:FLAT端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6.92 mmBase Number Matches:1

TIBPAL16L8-15MWB 数据手册

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TIBPAL16L8-15M, TIBPAL16R4-15M, TIBPAL16R6-15M, TIBPAL16R8-15M  
HIGH-PERFORMANCE IMPACT PAL CIRCUITS  
SRPS018A – D3338, JANUARY 1986 – REVISED MAY 1996  
TIBPAL16L8’  
J OR W PACKAGE  
High-Performance Operation:  
Propagation Delay . . . 15 ns Max  
(TOP VIEW)  
Power-Up Clear on Registered Devices (All  
Register Outputs are Set High, but Voltage  
Levels at the Output Pins Go Low)  
I
I
I
I
I
I
I
I
I
V
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
CC  
O
I/O  
Package Options Include Ceramic Flat (W)  
Packages, Ceramic Chip Carriers (FK), and  
Ceramic (J) 300-mil DIPs  
17 I/O  
16 I/O  
15 I/O  
14 I/O  
13 I/O  
Dependable Texas Instruments Quality and  
Reliability  
I
3-STATE  
REGISTERED  
Q OUTPUTS  
I/O  
PORTS  
DEVICE  
INPUTS O OUTPUTS  
12  
11  
O
I
PAL16L8  
PAL16R4  
PAL16R6  
PAL16R8  
10  
8
2
0
0
0
0
6
4
2
0
GND  
4 (3-state buffers)  
6 (3-state buffers)  
8 (3-state buffers)  
8
TIBPAL16L8’  
FK PACKAGE  
8
(TOP VIEW)  
description  
These programmable array logic devices feature  
high speed and functional equivalency when  
compared with currently available devices. These  
IMPACT-X circuits combine the latest Advanced  
Low-Power Schottky technology with proven  
titanium-tungsten fuses to provide reliable,  
high-performance substitutes for conventional  
TTL logic. Their easy programmability allows for  
quick design of custom functions and typically  
results in a more compact circuit board. In  
addition, chip carriers are available for futher  
reduction in board space.  
3
2 1 20 19  
I/O  
I/O  
I/O  
I/O  
I/O  
I
I
I
I
I
18  
17  
16  
15  
14  
4
5
6
7
8
9 10 11 12 13  
Pin assignments in operating mode  
The TIBPAL16’ M series is characterized for  
operation over the full military temperature range  
of –55°C to 125°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
IMPACT is a trademark of Texas Instruments Incorporated.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
Copyright 1996, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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