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CC2540F128RHAT PDF预览

CC2540F128RHAT

更新时间: 2024-01-19 06:48:24
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路uCs集成电路uPs集成电路PC蓝牙
页数 文件大小 规格书
33页 770K
描述
2.4-GHz Bluetooth? low energy System-on-Chip

CC2540F128RHAT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:VQFN-40针数:40
Reach Compliance Code:compliantHTS代码:8542.31.00.01
Factory Lead Time:1 week风险等级:2.14
Samacsys Confidence:3Samacsys Status:Released
2D Presentation:https://componentsearchengine.com/2D/0T/5731.2.1.pngSchematic Symbol:https://componentsearchengine.com/symbol.php?partID=5731
PCB Footprint:https://componentsearchengine.com/footprint.php?partID=57313D View:https://componentsearchengine.com/viewer/3D.php?partID=5731
Samacsys PartID:5731Samacsys Image:https://componentsearchengine.com/Images/9/CC2540F128RHAT.jpg
Samacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/2/CC2540F128RHAT.jpgSamacsys Pin Count:41
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Quad Flat No-Lead
Samacsys Footprint Name:RHA (S-PVQFN-N40)_1Samacsys Released Date:2015-04-16 09:48:08
Is Samacsys:N总线兼容性:SPI; USART; USB
JESD-30 代码:S-PQCC-N40JESD-609代码:e4
长度:6 mm湿度敏感等级:3
端子数量:40最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN封装等效代码:LCC40,.24SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:3 V
认证状态:Not QualifiedRAM(字节):8192
RAM(字数):8座面最大高度:1 mm
子类别:Other uPs/uCs/Peripheral ICs最大供电电压:3.6 V
最小供电电压:2 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT
Base Number Matches:1

CC2540F128RHAT 数据手册

 浏览型号CC2540F128RHAT的Datasheet PDF文件第2页浏览型号CC2540F128RHAT的Datasheet PDF文件第3页浏览型号CC2540F128RHAT的Datasheet PDF文件第4页浏览型号CC2540F128RHAT的Datasheet PDF文件第5页浏览型号CC2540F128RHAT的Datasheet PDF文件第6页浏览型号CC2540F128RHAT的Datasheet PDF文件第7页 
CC2540F128, CC2540F256  
www.ti.com  
SWRS084 OCTOBER 2010  
2.4-GHz Bluetooth® low energy System-on-Chip  
Check for Samples: CC2540F128, CC2540F256  
1
FEATURES  
Peripherals  
23456  
• True Single-Chip BLE Solution: CC2540 Can  
12-Bit ADC with Eight Channels and  
Configurable Resolution  
Run Both Application and BLE Protocol Stack,  
Includes Peripherals to Interface With Wide  
Range of Sensors, Etc.  
Integrated High-Performance Op-Amp and  
Ultralow-Power Comparator  
6-mm × 6-mm Package  
RF  
General-Purpose Timers (One 16-Bit, Two  
8-Bit)  
Bluetooth low energy technology  
21 General-Purpose I/O Pins (19× 4 mA, 2×  
20 mA)  
Compatible  
Excellent Link Budget (up to 97 dB),  
Enabling Long-Range Applications Without  
External Front End  
32-kHz Sleep Timer With Capture  
Two Powerful USARTs With Support for  
Several Serial Protocols  
Accurate Digital Received Signal-Strength  
Indicator (RSSI)  
Full-Speed USB Interface  
IR Generation Circuitry  
Suitable for Systems Targeting Compliance  
With Worldwide Radio Frequency  
Regulations: ETSI EN 300 328 and EN 300  
440 Class 2 (Europe), FCC CFR47 Part 15  
(US), and ARIB STD-T66 (Japan)  
Powerful Five-Channel DMA  
AES Security Coprocessor  
Battery Monitor and Temperature Sensor  
Each CC2540 Contains a Unique 48-bit  
IEEE Address  
Layout  
Development Tools  
Few External Components  
CC2540 Mini Development Kit  
Reference Design Provided  
Royalty-Free Bluetooth low energy Protocol  
6-mm × 6-mm QFN40 Package  
Stack  
Low Power  
SmartRF™ Software  
Active Mode RX Down to 19.6 mA  
Supported by IAR Embedded Workbench™  
Software for 8051  
Active Mode TX (–6 dBm): 24 mA  
Power Mode 1 (3-ms Wake-Up): 235 mA  
Power Mode 2 (Sleep Timer On): 0.9 mA  
Power Mode 3 (External Interrupts): 0.4 mA  
Wide Supply Voltage Range (2 V–3.6 V)  
APPLICATIONS  
2.4-GHz Bluetooth low energy Systems  
Mobile Phone Accessories  
Sports and Leisure Equipment  
Consumer Electronics  
Human Interface Devices (Keyboard, Mouse,  
Remote Control)  
Full RAM and Register Retention in All  
Power Modes  
Microcontroller  
High-Performance and Low-Power 8051  
Microcontroller Core  
USB Dongles  
Health Care and Medical  
In-System-Programmable Flash, 128 KB or  
256 KB  
8-KB SRAM  
A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
4
5
6
SmartRF is a trademark of Texas Instruments.  
Bluetooth is a registered trademark of Bluetooth SIG, Inc.  
Supported by IAR Embedded Workbench is a trademark of IAR Systems AB.  
ZigBee is a registered trademark of ZigBee Alliance.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010, Texas Instruments Incorporated  

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