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1P1G08MDBVREPG4 PDF预览

1P1G08MDBVREPG4

更新时间： 2024-02-15 02:57:07
品牌 Logo 应用领域
德州仪器 - TI 栅极触发器逻辑集成电路光电二极管输入元件PC
页数 文件大小 规格书
16页 488K
描述
SINGLE 2-INPUT POSITIVE-AND GATE

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1P1G08MDBVREPG4 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active零件包装代码：SOT-23
包装说明：SOT-23, 5 PIN针数：5
Reach Compliance Code：compliantHTS代码：8542.39.00.01
Factory Lead Time：6 weeks风险等级：5.26
Samacsys Confidence：Samacsys Status：Released
Schematic Symbol：https://componentsearchengine.com/symbol.php?partID=605110PCB Footprint：https://componentsearchengine.com/footprint.php?partID=605110
Samacsys PartID：605110Samacsys Image：https://componentsearchengine.com/Images/9/1P1G08MDBVREPG4.jpg
Samacsys Thumbnail Image：https://componentsearchengine.com/Thumbnails/1/1P1G08MDBVREPG4.jpgSamacsys Pin Count：5
Samacsys Part Category：Integrated CircuitSamacsys Package Category：Other
Samacsys Footprint Name：SOT95P280X145-5NSamacsys Released Date：2017-01-12 12:59:53
Is Samacsys：N系列：LVC/LCX/Z
JESD-30 代码：R-PDSO-G5JESD-609代码：e4
长度：2.9 mm负载电容（CL）：50 pF
逻辑集成电路类型：AND GATE最大I（ol）：0.032 A
湿度敏感等级：1功能数量：1
输入次数：2端子数量：5
最高工作温度：125 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装代码：LSSOP
封装等效代码：TSOP5/6,.11,37封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, LOW PROFILE, SHRINK PITCH包装方法：TR
峰值回流温度（摄氏度）：260电源：3.3 V
最大电源电流（ICC）：0.01 mAProp。Delay @ Nom-Sup：6.5 ns
传播延迟（tpd）：11 ns认证状态：Not Qualified
施密特触发器：NO座面最大高度：1.45 mm
子类别：Gates最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：1.65 V标称供电电压 (Vsup)：1.8 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.95 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：1.6 mmBase Number Matches：1

1P1G08MDBVREPG4 数据手册

 浏览型号1P1G08MDBVREPG4的Datasheet PDF文件第2页浏览型号1P1G08MDBVREPG4的Datasheet PDF文件第3页浏览型号1P1G08MDBVREPG4的Datasheet PDF文件第4页浏览型号1P1G08MDBVREPG4的Datasheet PDF文件第5页浏览型号1P1G08MDBVREPG4的Datasheet PDF文件第6页浏览型号1P1G08MDBVREPG4的Datasheet PDF文件第7页 
SN74LVC1G08-EP  
SINGLE 2-INPUT POSITIVE-AND GATE  
www.ti.com  
SCES454C–DECEMBER 2003–REVISED AUGUST 2006  
FEATURES  
•
Controlled Baseline  
•
•
•
Ioff Supports Partial-Power-Down Mode  
Operation  
– One Assembly/Test Site, One Fabrication  
Site  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
•
Extended Temperature Performance of –55°C  
to 125°C  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
•
•
•
•
•
•
•
Enhanced Product-Change Notification  
– 1000-V Charged-Device Model (C101)  
(1)  
Qualification Pedigree  
DBV OR DCK PACKAGE  
(TOP VIEW)  
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 3.6 ns at 3.3 V  
1
2
3
5
4
A
B
V
Y
CC  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
GND  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
DESCRIPTION/ORDERING INFORMATION  
Y + A • B or Y + A ) B  
The SN74LVC1G08 performs the Boolean function  
in positive logic.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
SN74LVC1G08IDCKREP  
TOP-SIDE MARKING  
CEO  
–40°C to 85°C  
SOT (SC-70) – DCK  
Reel of 3000  
Reel of 3000  
Reel of 3000  
SOP (SOT-23) – DBV  
SOT (SC-70) – DCK  
SN74LVC1G08MDBVREP  
SN74LVC1G08MDCKREP  
C08O  
BUB  
–55°C to 125°C  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
A
H
L
B
H
X
L
H
L
L
X
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...16

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