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1734352-1 PDF预览

1734352-1

更新时间: 2024-01-27 02:42:09
品牌 Logo 应用领域
德州仪器 - TI 连接器PC
页数 文件大小 规格书
35页 2529K
描述
Multi-Cal-System Evaluation Module

1734352-1 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:ROHS COMPLIANT
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8536.69.40.30风险等级:8.48
Is Samacsys:N其他特性:ROHS COMPLIANT
主体宽度:0.492 inch主体深度:0.488 inch
主体长度:1.213 inch主体/外壳类型:PLUG
连接器类型:D SUBMINIATURE CONNECTOR联系完成配合:NOT SPECIFIED
联系完成终止:Matte Tin (Sn)触点性别:MALE
触点材料:BRASS触点模式:STAGGERED
触点电阻:40 m Ω触点样式:RND PIN-SKT
DIN 符合性:NO介电耐压:1000VAC V
空壳:NO滤波功能:NO
IEC 符合性:NO最大插入力:2.9468 N
绝缘电阻:1000000000 Ω绝缘体颜色:BLACK
绝缘体材料:POLYETHYLENEJESD-609代码:e3
MIL 符合性:NO插接触点节距:0.109 inch
匹配触点行间距:0.112 inch混合触点:NO
安装选项1:#4-40安装选项2:RIVET
安装方式:RIGHT ANGLE安装类型:BOARD
PCB行数:2装载的行数:2
最高工作温度:105 °C最低工作温度:-55 °C
选件:GENERAL PURPOSEPCB接触模式:STAGGERED
PCB触点行间距:2.8448 mm电镀厚度:FLASH inch
额定电流(信号):2 A参考标准:UL
可靠性:COMMERCIAL外壳面层:NICKEL
外壳材料:STEEL外壳尺寸:1/E
子类别:D Type Connectors端子长度:0.126 inch
端子节距:2.7686 mm端接类型:SOLDER
触点总数:9UL 易燃性代码:94V-0
撤离力-最小值:.1946 NBase Number Matches:1

1734352-1 数据手册

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User's Guide  
SBOU087AAugust 2010Revised April 2011  
Multi-Cal-System Evaluation Module  
This users guide describes the characteristics, operation, and the use of the Multi-Cal-System evaluation  
module (EVM). It covers all pertinent areas involved to properly use this EVM board. The document  
includes the physical printed circuit board layout, schematic diagrams, and circuit descriptions.  
Contents  
1
2
3
4
5
Overview ..................................................................................................................... 3  
Starter System Setup ....................................................................................................... 9  
Expanding the System Size .............................................................................................. 22  
Troubleshooting Tips ...................................................................................................... 28  
Bill of Materials ............................................................................................................. 29  
List of Figures  
1
Hardware Included with the Multi-Cal-System EVM Kit................................................................  
Multi-Cal-Slave Kit ..........................................................................................................  
Multi-Cal-Interface PCA Card .............................................................................................  
Multi-Cal-Test PCA Card...................................................................................................  
Multi-Cal-Interface Cable...................................................................................................  
Multi-Cal-Power Cable .....................................................................................................  
Multi-Cal-System EVM Hardware Setup.................................................................................  
3
4
4
5
6
6
9
2
3
4
5
6
7
8
Connect Multi-Cal-Master PCA to USB DAQ Platform ............................................................... 10  
Connect Multi-Cal-Interface Cable to Multi-Cal-Master PCA Card.................................................. 11  
Connect Multi-Cal-Interface Cable to Multi-Cal-Interface PCA Card ............................................... 11  
Jumpers on Multi-Cal-Interface PCA Card ............................................................................. 12  
Jumpers on Multi-Cal-Test PCA Card .................................................................................. 13  
Connect Multi-Cal-Test PCA Card to Multi-Cal-Interface PCA Card ............................................... 14  
Connect Multi-Cal-Power Cable to Multi-Cal-Master PCA Card .................................................... 15  
Connect Multi-Cal-Power Cable to Power Supplies (Current Loop Output) ....................................... 16  
Connect Multi-Cal-Power-Cable to Power Supplies (Voltage Output).............................................. 17  
Typical Instrument Connection .......................................................................................... 18  
Connect Serial Port to DMM ............................................................................................. 19  
Connect IEEE488 to DMM ............................................................................................... 20  
Universal 9-V Supply to USB DAQ Platform........................................................................... 21  
Connect USB Cable to USB DAQ Platform............................................................................ 21  
Complete System Setup.................................................................................................. 22  
Replace Standoffs......................................................................................................... 22  
Connect the Ribbon Cable to the Master .............................................................................. 23  
Connect Slave Ribbon Cable to Slave.................................................................................. 24  
Secure Slave to Master................................................................................................... 25  
Cable Connections to Slave Board ..................................................................................... 26  
Jumper Locations and Positions for Expanding System Size ....................................................... 27  
9
10  
11  
12  
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15  
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17  
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28  
Microsoft, Windows are registered trademarks of Microsoft Corporation.  
All other trademarks are the property of their respective owners.  
1
SBOU087AAugust 2010Revised April 2011  
Multi-Cal-System Evaluation Module  
Submit Documentation Feedback  
Copyright © 20102011, Texas Instruments Incorporated  

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