Datasheet > TGON810

TGON810

更新时间： 2024-10-31 02:51:55

品牌	Logo	应用领域
LSTD		/
页数	文件大小	规格书
2页	375K
描述
Electrically and Thermally Conductive Interface Pad

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TGON810 数据手册

Tgon 800 Series

Electrically and Thermally

Conductive Interface Pad

Innovative Technology

for a Connected World

HꢀꢁH-PERFORMANCE, COST EFFECTꢀvE THERMAl ꢀNTERFACE MATERꢀAl

Used where electrical isolation is not required, Tgon^™800 is ideal for where electrical

contact and thermal transfer are desired.

Its unique grain-oriented, plate-like structure provides a high thermal conductivity of

240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied

in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut

to speciﬁc conﬁgurations.

It is also available with proprietary pressure sensitive adhesive on one side. This adhesive

coating is the thinnest available, minimizing any impact on thermal performance.

FEATURES

• High thermal conductivity of 5 W/mK in Z axis and 240 W/mK in the X-Y axis

• >98% graphite

• Low thermal resistance

• Thicknesses of 0.005”, 0.010” and 0.020” (0.125mm, 0.25mm, and 0.50mm)

APPlꢀCATꢀONS

• Power conversion equipment

• Power supplies

• Large telecommunications switching hardware

• Notebook computers

• Where electrical grounding is required with good thermal conductivity

global solutions: local support_TM

Americas: +1.888.246.9050

Europe: +49.0.8031.2460.0

Asia: +86.755.2714.1166

CLV-customerservice@lairdtech.com

www.lairdtech.com/thermal

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