Datasheet > TG6050-100-100-3.0-0

TG6050-100-100-3.0-0

更新时间： 2024-01-17 19:23:48

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
2页	668K
描述
THERM PAD 100MMX100MM RED

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TG6050-100-100-3.0-0 数据手册

TG6050

Ultra-Soft Thermal Conductive Pad

Version 2.130218

Ultra-Soft Thermal Conductive Pad

TG6050 is an ultra-soft, silicone based thermal interface material. TG6050 has a

low thermal impedance, conforms readily to surfaces due to its low hardness and

provides a high dielectric breakdown voltage. TG6050 can be provided in various

thicknesses and formats, such as custom die cuts, standard sheets or log rolls

depending on the end application.

Features

Superior thermal conductivity

Highly compressible

Naturally tacky

Low Shore 00 hardness

Low oil bleed

Electrically insulating

Applications

Electronic components: IC, CPU, MOS

LED, M/B, P/S, Heat Sink

LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.

DDR II Module, DVD Applications, Hand-set applications, etc.

Properties

REACH Compliant

ROHS Compliant

Property

TG6050

Red

Unit

Tolerance Test Method

Colour

Visual

0.5 - 5.0

Inch

ASTM D374

Thickness

0.0197 - 0.0787

Thermal Conductivity

Flammability Rating

W/mK

0.6

ASTM D5470

UL 94

V-0

Dielectric Breakdown Voltage

Weight Loss

‹1

kV/mm

1.3

ASTM D149

ASTM E595

ASTM D792

Density

3.2

g/cm³

˚C

0.2

Working Temperature

Volume Resistance

Elongation

-45 to 200

›10¹²

Ohm-cm

ASTM D257

ASTM D412

ASTM D2240

Tensile Strength

Hardness

0.5

Kgf/cm²

Shore 00

months

Shelf Life

Shelf Life with adhesive

(can be requaliﬁed for further

12)

months

Thermal Impedance vs Pressure vs Deﬂection

T-Global Technology Limited

1 & 2 Cosford Business Park, Central Park,

Lutterworth, Leicestershire LE17 4QU U.K.

Tel: +44 (0)1455 553 510

Email: sales@tglobaltechnology.com

Web: www.tglobaltechnology.com

Skype: tglobal.technology

VAT #: GB 116 662 714

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