TG6050
Ultra-Soft Thermal Conductive Pad
Version 2.130218
Ultra-Soft Thermal Conductive Pad
TG6050 is an ultra-soft, silicone based thermal interface material. TG6050 has a
low thermal impedance, conforms readily to surfaces due to its low hardness and
provides a high dielectric breakdown voltage. TG6050 can be provided in various
thicknesses and formats, such as custom die cuts, standard sheets or log rolls
depending on the end application.
Features
Superior thermal conductivity
Highly compressible
Naturally tacky
Low Shore 00 hardness
Low oil bleed
Electrically insulating
Applications
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
Properties
REACH Compliant
ROHS Compliant
Property
TG6050
Red
Unit
-
Tolerance Test Method
Colour
-
-
-
Visual
0.5 - 5.0
mm
Inch
ASTM D374
ASTM D374
Thickness
0.0197 - 0.0787
Thermal Conductivity
Flammability Rating
6
W/mK
-
0.6
-
ASTM D5470
UL 94
V-0
Dielectric Breakdown Voltage
Weight Loss
13
‹1
kV/mm
%
1.3
-
ASTM D149
ASTM E595
ASTM D792
-
Density
3.2
g/cm³
˚C
0.2
-
Working Temperature
Volume Resistance
Elongation
-45 to 200
›10¹²
50
Ohm-cm
%
-
ASTM D257
ASTM D412
ASTM D412
ASTM D2240
-
13
2
Tensile Strength
Hardness
0.5
Kgf/cm²
Shore 00
months
60
15
-
Shelf Life
36
Shelf Life with adhesive
(can be requalified for further
12)
12
months
-
-
Thermal Impedance vs Pressure vs Deflection
T-Global Technology Limited
1 & 2 Cosford Business Park, Central Park,
Lutterworth, Leicestershire LE17 4QU U.K.
Tel: +44 (0)1455 553 510
Email: sales@tglobaltechnology.com
Web: www.tglobaltechnology.com
Skype: tglobal.technology
VAT #: GB 116 662 714