Datasheet > TFLEXHR610FG

TFLEXHR610FG

更新时间： 2024-09-19 02:52:11

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LSTD		/
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Thermal Gap Filler

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TFLEXHR610FG 数据手册

Tflex HR600 Series

Thermal Gap Filler

Innovative Technology

for a Connected World

Mid-Performance Gap Filler with 3 W/mK

Tﬂex^™HR600 is a cost-effective and compliant gap ﬁller thermal interface material with

excellent thermal performance and great handling for mass-production applications.

The low modulus interface pad conforms to component topography, resulting in little stress

on the components, mating chassis or parts. The softness relieves mechanical stress from

high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tﬂex

HR600’s recovery properties for applications requiring material rework result in continued

mechanical integrity even after device rework and re-assembly.

Tﬂex HR600 is naturally tacky on both sides and requires no additional adhesive coating to

inhibit thermal performance. The tack is designed to hold the pad in place during

assembly and component transport.

Tﬂex HR600 is electrically insulating, stable from -45ºC thru 200ºC, and meets UL 94V0

ﬂame rating.

Features and Beneﬁts

• Thermal conductivity 3 W/mK

• Soft and compliant

• Available in thicknesses from 0.010” thru 0.200” (0.25mm thru 5.0mm)

• Naturally tacky for adhesion during assembly and transport

Applications

• Cooling components to chassis, frame, or other mating components

• Memory modules

• Home and small ofﬁce network equipment

• Mass storage devices

• Automotive electronics

• Telecommunication hardware

• Radios

• LED solid state lighting

• Power electronics

• LCD and PDP ﬂat panel TV

• Set top boxes

• Audio and video components

• IT infrastructure

• GPS navigation and other portable devices

global solutions: local support_TM

Americas: +1.800.843.4556

Europe: +49.8031.2460.0

Asia: +86.755.2714.1166

CLV-customerservice@lairdtech.com

www.lairdtech.com/thermal

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