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TFDU6300-TT3

更新时间: 2024-09-18 05:52:47
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
15页 214K
描述
Fast Infrared Transceiver Module (FIR, 4 Mbit/s) for 2.4 V to 3.6 V Operation

TFDU6300-TT3 技术参数

是否无铅: 不含铅生命周期:Obsolete
零件包装代码:MODULE包装说明:,
针数:8Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.83
接口集成电路类型:INTERFACE CIRCUITJESD-30 代码:R-XSMA-L8
JESD-609代码:e3湿度敏感等级:4
功能数量:1端子数量:8
最高工作温度:85 °C最低工作温度:-25 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):260
认证状态:Not Qualified最大供电电压:3.6 V
最小供电电压:2.4 V标称供电电压:3.3 V
电源电压1-最大:3.6 V电源电压1-分钟:2.4 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:Matte Tin (Sn)
端子形式:L BEND端子位置:SINGLE
处于峰值回流温度下的最长时间:40

TFDU6300-TT3 数据手册

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TFDU6300  
Vishay Semiconductors  
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)  
for 2.4 V to 3.6 V Operation  
Description  
The TFDU6300 transceiver is an infrared transceiver  
module compliant to the latest IrDA physical layer  
low-power standard for fast infrared data  
communication, supporting IrDA speeds up to  
®
®
4 Mbit/s (FIR), HP-SIR , Sharp ASK and carrier  
based remote control modes up to 2 MHz. Integrated  
within the transceiver module is a photo PIN diode, an  
infrared emitter (IRED), and a low-power control IC to  
provide a total front-end solution in a single package.  
This new Vishay FIR transceiver is built in a new  
smaller package using the experiences of the lead  
20101  
frame BabyFace technology. The transceivers are implementing a complete solution. TFDU6300 has a  
capable of directly interfacing with a wide variety of tri-state output and is floating in shutdown mode with  
I/O devices, which perform the modulation/ a weak pull-up. An otherwise identical transceiver  
demodulation function. At a minimum, a V bypass with low-voltage (1.8 V) logic levels is available as  
CC  
capacitor is the only external component required TFDU6301.  
Features  
• Compliant to the latest IrDA physical layer  
specification (up to 4 Mbit/s) with an  
extended low power range of > 70 cm  
(typ. 1 m) and TV remote control (> 9 m)  
• Low profile (universal) package capable of surface  
mount soldering to side and top view orientation  
• Directly interfaces with various super I/O and  
controller devices  
e3  
• Operates from 2.4 V to 3.6 V within  
specification  
• Low power consumption (1.8 mA typ. supply  
current)  
• Only one external component required  
• Split power supply, transmitter and receiver can be  
operated from two power supplies with relaxed  
requirements saving costs  
• Power shutdown mode (0.01 µA typ. shutdown  
current)  
• Lead (Pb)-free device  
• Qualified for lead (Pb)-free and Sn/Pb processing  
(MSL4)  
• Device in accordance with RoHS 2002/95/EC and  
WEEE 2002/96EC  
• Surface mount package  
- Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)  
• Tri-state-receiver output, floating in shut down with  
a weak pull-up  
Applications  
• Notebook computers, desktop PCs, palmtop  
computers (Win CE, Palm PC), PDAs  
• Telecommunication products (cellular phones,  
pagers)  
• Digital cameras and video cameras  
• Printers, fax machines, photocopiers, screen  
projectors  
• Internet TV boxes, video conferencing systems  
• External infrared adapters (dongles)  
• Medical and industrial data collection  
Parts Table  
Part  
TFDU6300-TR3  
Description  
Qty/reel or tube  
Oriented in carrier tape for side view surface mounting  
Oriented in carrier tape for top view surface mounting  
Oriented in carrier tape for side view surface mounting  
Oriented in carrier tape for top view surface mounting  
2500 pcs  
2500 pcs  
750 pcs  
750 pcs  
TFDU6300-TT3  
TFDU6300-TR1  
TFDU6300-TT1  
www.vishay.com  
1
Document Number 84763  
Rev. 1.8, 03-Jul-08  

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