Datasheet > TFDH6541

TFDH6541

更新时间： 2024-11-08 05:06:03

品牌	Logo	应用领域
威世 - VISHAY		光纤
页数	文件大小	规格书
13页	262K
描述
Transceiver, Through Hole Mount,

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技术参数
数据手册

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TFDH6541 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	风险等级：	5.83
光纤设备类型：	TRANSCEIVER	JESD-609代码：	e0
安装特点：	THROUGH HOLE MOUNT	最高工作温度：	85 °C
最低工作温度：	-25 °C	子类别：	Fiber Optic Transceivers
最大供电电压：	5.5 V	表面贴装：	NO
端子面层：	Tin/Lead (Sn/Pb)	Base Number Matches：	1

TFDH6541 数据手册

TFDH6131/TFDH6541

Vishay Telefunken

Fast Infrared Transceiver Module Family

(FIR, 4 Mbit/s) for 2.6 V to 5.5 V Operation

Description

The TFDH6131 and TFDH6541 transceivers are is based on the standard package with the leads single

package modification inside the 6000E – family of in line (SIL), the other based on the BabyFace

low–power infrared transceiver modules compliant to package, leads dual in line. The transceivers are

the IrDA physical layer standard for fast infrared data capable of directly interfacing with a wide variety of I/O

communication, supporting IrDA speeds up to 4 Mbit/s devices which perform the modulation/ demodulation

(FIR), HP-SIR, Sharp ASK and carrier based remote function,

including

National

Semiconductor’s

control modes up to 2 MHz. Integrated within the PC87338, PC87108 and PC87109, SMC’s

transceiver modulesareaphotoPINdiode, aninfrared FDC37C669, FDC37N769 and CAM35C44, and

emitter (IRED), and a low–power CMOS control IC to Hitachi’s SH3. At a minimum, a current–limiting

provide a total front–end solution in a single package. resistor in series with the infrared emitter and a

bypass capacitor are the only external

Vishay Telefunken’s through hole package FIR components required implementing a complete

transceivers areavailableintwopackageoptions.One solution.

F_De_Ca_ot_mu_pr_le_ias_{nt to the latest IrDA physical layer}

D Push–Pull–Receiver Output, grounded in

standard, (FIR 4 Mbit/s, full range),

shutdown mode for device identification

HP–SIR , Sharp ASK and TV Remote Control

D High Efficiency Emitter

D For 3.0 V and 5.0 V Applications

D Directly Interfaces with Various Super I/O and

Controller Devices

D Operates from 2.6 V to 5.5 V within specification,

operational down to 2.4 V

D Built–In EMI Protection – No External Shielding

Necessary

D Low Power Consumption (3 mA Supply Current)

D Power Shutdown Mode (1 mA Shutdown Current)

D Two Surface Mount Package Options

D Few External Components Required

D Split power supply, transmitter and receiver can be

operated from two power supplies with relaxed

requirements saving costs, covered by

US Patent 08995536

–

Side View (13.0 × 5.95 × 4.3 mm)

Side View (9.7 × 4.7 × 4.0 mm)

A_Dp_Np_otl_eic_boa_ot_kio_Con_ms_{puters, Desktop PCs,}

D Internet TV Boxes, Video Conferencing Systems

D External Infrared Adapters (Dongles)

D Medical and Industrial Data Collection

Palmtop Computers (Win CE, Palm PC), PDAs

D Printers, Fax Machines, Photocopiers,

Screen Projectors

Package Options

TFDH6131

Side View

Through Hole DIL

TFDH6541

Side View

Through Hole SIL

www.vishay.com

1 (13)

DocumentNumber82527

Rev. A1.1,29-Jan-01

12 3 4 5 6 7...13

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与TFDH6541相关器件

型号	品牌	获取价格	描述	数据表
TFDH6542	VISHAY	获取价格	Transceiver, Through Hole Mount,
TFDS-05-28-G-03.25-D-NDX	SAMTEC	获取价格	Interconnection Device
TFDS-05-28-G-03.25-D-NUS	SAMTEC	获取价格	Interconnection Device
TFDS-05-28-G-03.25-T-NDS	SAMTEC	获取价格	Interconnection Device
TFDS-05-28-G-03.25-T-NDX	SAMTEC	获取价格	Interconnection Device
TFDS-05-28-G-03.25-T-NUX	SAMTEC	获取价格	Interconnection Device
TFDS-05-28-GF-03.25-D-NUX	SAMTEC	获取价格	Interconnection Device
TFDS-05-28-GF-03.25-T-NDS	SAMTEC	获取价格	Interconnection Device
TFDS-05-28-GF-03.25-T-NUX	SAMTEC	获取价格	Interconnection Device
TFDS-05-28-H-03.25-D-NUX	SAMTEC	获取价格	Interconnection Device

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