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TEA1062M1 PDF预览

TEA1062M1

更新时间: 2024-11-06 22:19:55
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
28页 215K
描述
Low voltage transmission circuits with dialler interface

TEA1062M1 技术参数

生命周期:Active零件包装代码:DIP
包装说明:DIP, DIP16,.3针数:16
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.22JESD-30 代码:R-PDIP-T16
JESD-609代码:e3/e4长度:19.025 mm
功能数量:1端子数量:16
最高工作温度:75 °C最低工作温度:-25 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP16,.3封装形状:RECTANGULAR
封装形式:IN-LINE电源:3.4 V
认证状态:Not Qualified座面最大高度:4.2 mm
子类别:Telephone Circuits最大压摆率:1.35 mA
标称供电电压:3.4 V表面贴装:NO
技术:BIPOLAR电信集成电路类型:TELEPHONE SPEECH CIRCUIT
温度等级:COMMERCIAL EXTENDED端子面层:TIN/NICKEL PALLADIUM GOLD
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:7.62 mm
Base Number Matches:1

TEA1062M1 数据手册

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INTEGRATED CIRCUITS  
DATA SHEET  
TEA1062; TEA1062A  
Low voltage transmission circuits  
with dialler interface  
1997 Sep 03  
Product specification  
Supersedes data of 1996 Dec 04  
File under Integrated Circuits, IC03  

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LOW VOLTAGE TELEPHONE TRANSMISSION CIRCUIT WITH DIALLER INTERFACE