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TE28F640C3TC100 PDF预览

TE28F640C3TC100

更新时间: 2024-11-14 07:23:15
品牌 Logo 应用领域
英特尔 - INTEL 光电二极管
页数 文件大小 规格书
76页 1020K
描述
Flash, 4MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48

TE28F640C3TC100 数据手册

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3-Volt Advanced+ Boot Block Flash  
Memory  
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)  
Preliminary Datasheet  
Product Features  
Flexible SmartVoltage Technology  
2.7 V–3.6 V Read/Program/Erase  
12 V for Fast Production Programming  
128-bit Protection Register  
64-bit Unique Device Identifier  
64-bit User Programmable OTP Cells  
1.65 V–2.5 V or 2.7 V–3.6 V I/O Option  
Reduces Overall System Power  
Extended Cycling Capability  
Minimum 100,000 Block Erase Cycles  
Supports Intel® Flash Data Integrator  
Software  
Flash Memory Manager  
System Interrupt Manager  
Supports Parameter Storage, Streaming  
Data (e.g., voice)  
High Performance  
2.7 V–3.6 V: 70 ns Max Access Time  
Optimized Architecture for Code Plus  
Data Storage  
Eight 4-Kword Blocks, Top or Bottom  
Locations  
Up to One Hundred-Twenty-Seven 32-  
Kword Blocks  
Fast Program Suspend Capability  
Fast Erase Suspend Capability  
Automated Word/Byte Program and  
Block Erase  
Command User Interface  
Status Registers  
Cross-Compatible Command Support  
Intel Basic Command Set  
Common Flash Interface  
Flexible Block Locking  
Lock/Unlock Any Block  
Full Protection on Power-Up  
WP# Pin for Hardware Block Protection  
Standard Surface Mount Packaging  
48-Ball CSP Packages  
64-Ball Easy BGA Packages  
48-Lead TSOP Package  
—V = GND Option  
PP  
—V Lockout Voltage  
CC  
Low Power Consumption  
—9 mA Typical Read Power  
—7 µA Typical Standby Power with  
Automatic Power Savings Feature  
ETOX™ VIII (0.13 µm) Flash  
Technology  
32- and 64-Mbit  
12 V Fast Production Program  
ETOX™ VII (0.18 µm) Flash Technology  
16-, 32-, 64-Mbit  
Extended Temperature Operation  
40 °C to +85 °C  
ETOX™ VI (0.25 µm) Flash Technology  
8-, 16- and 32-Mbit  
The 3-Volt Advanced+ Boot Block Flash memory, manufactured on Intel’s latest 0.13 µm and  
0.18 µm technologies, represents a feature-rich solution for low-power applications. 3-Volt  
Advanced+ Boot Block Flash memory devices incorporate low-voltage capability (2.7 V read,  
program and erase) with high-speed, low-power operation. Flexible block locking allows any  
Notice: This document contains preliminary information on new products in production. The  
specifications are subject to change without notice. Verify with your local Intel sales office that  
you have the latest datasheet before finalizing a design.  
Order Number: 290645-012  
October 2001  

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