Datasheet > TE28F320C3TC80

TE28F320C3TC80

更新时间： 2024-11-15 04:24:35

品牌	Logo	应用领域
恒忆 - NUMONYX		光电二极管
页数	文件大小	规格书
70页	903K
描述
Flash, 2MX16, 80ns, PDSO48, 12 X 20 MM, TSOP-48

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TE28F320C3TC80 数据手册

3 Volt Advanced+ Boot Block Flash

Memory

28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)

Preliminary Datasheet

Product Features

■ Flexible SmartVoltage Technology

—2.7 V–3.6 V Read/Program/Erase

—12 V for Fast Production Programming

■ High Performance

—2.7 V–3.6 V: 70 ns Max Access Time

■ Optimized Architecture for Code Plus Data

Storage

■ Improved 12 V Production Programming

—Faster Production Programming

—No Additional System Logic

■ 128-bit Protection Register

—64-bit Unique Device Identifier

—64-bit User Programmable OTP Cells

■ Extended Cycling Capability

—Minimum 100,000 Block Erase Cycles

■ Supports Flash Data Integrator Software

—Flash Memory Manager

—Eight 4-Kword Blocks, Top or Bottom

Locations

—Up to One Hundred-Twenty-Seven 32-

Kword Blocks

—System Interrupt Manager

—Fast Program Suspend Capability

—Fast Erase Suspend Capability

■ Flexible Block Locking

—Supports Parameter Storage, Streaming

Data (e.g., voice)

■ Automated Word/Byte Program and Block

—Lock/Unlock Any Block

Erase

—Command User Interface

—Full Protection on Power-Up

—WP# Pin for Hardware Block Protection

—V_PP= GND Option

—Status Registers

■ Cross-Compatible Command Support

—Intel Basic Command Set

—V_CCLockout Voltage

—Common Flash Interface

■ Low Power Consumption

—9 mA Typical Read Power

—7 µA Typical Standby Power with

Automatic Power Savings Feature

■ Extended Temperature Operation

—–40 °C to +85 °C

■ x16 I/O for Various Applications

—48-Ball µBGA* Package

—48-Ball VF BGA Package

—64-Ball Easy BGA Package

—48-Lead TSOP Package

■ 0.18 µ ETOX™ VII Flash Technology

The 3 Volt Advanced+ Boot Block Flash memory, manufactured on Intel’s latest 0.18 µ

technology, represents a feature-rich solution for low power applications. 3 Volt Advanced+

Boot Block Flash memory devices incorporate low voltage capability (2.7 V read, program and

erase) with high-speed, low-power operation. Flexible block locking allows any block to be

independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI)

software and you have a cost-effective, flexible, monolithic code plus data storage solution.

Intel® 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 48-ball

µBGA*, 48-ball Very Thin Profile Fine Pitch BGA (VF BGA), and 64-ball Easy BGA

packages. Additional information on this product family can be obtained by accessing the Intel^®

Flash website: http://www.intel.com/design/flash.

Notice: This document contains preliminary information on new products in production. The

specifications are subject to change without notice. Verify with your local Intel sales office that

you have the latest datasheet before finalizing a design.

Order Number: 290645-009

April 2000

12 3 4 5 6 7...70

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与TE28F320C3TC80相关器件

型号	品牌	获取价格	描述	数据表
TE28F320C3TC90	INTEL	获取价格	Advanced+ Boot Block Flash Memory (C3)
TE28F320C3TD70	INTEL	获取价格	Advanced+ Boot Block Flash Memory (C3)
TE28F320J3A-110	INTEL	获取价格	Intel StrataFlash Memory (J3)
TE28F320J3A-115	INTEL	获取价格	Intel StrataFlash Memory (J3)
TE28F320J3A-120	INTEL	获取价格	Intel StrataFlash Memory (J3)
TE28F320J3A-125	INTEL	获取价格	Intel StrataFlash Memory (J3)
TE28F320J3A-150	INTEL	获取价格	Intel StrataFlash Memory (J3)
TE28F320J3C	INTEL	获取价格	Intel StrataFlash Memory (J3)
TE28F320J3C-110	INTEL	获取价格	Intel StrataFlash Memory (J3)
TE28F320J3C110B	MICRON	获取价格	32Mb, 64Mb, 128Mb, 256Mb Monolithic Embedded Parallel NOR Flash Memory

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