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TE28F320C3TC80 PDF预览

TE28F320C3TC80

更新时间: 2024-09-26 04:24:35
品牌 Logo 应用领域
恒忆 - NUMONYX 光电二极管
页数 文件大小 规格书
70页 903K
描述
Flash, 2MX16, 80ns, PDSO48, 12 X 20 MM, TSOP-48

TE28F320C3TC80 数据手册

 浏览型号TE28F320C3TC80的Datasheet PDF文件第2页浏览型号TE28F320C3TC80的Datasheet PDF文件第3页浏览型号TE28F320C3TC80的Datasheet PDF文件第4页浏览型号TE28F320C3TC80的Datasheet PDF文件第5页浏览型号TE28F320C3TC80的Datasheet PDF文件第6页浏览型号TE28F320C3TC80的Datasheet PDF文件第7页 
3 Volt Advanced+ Boot Block Flash  
Memory  
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)  
Preliminary Datasheet  
Product Features  
Flexible SmartVoltage Technology  
2.7 V–3.6 V Read/Program/Erase  
12 V for Fast Production Programming  
High Performance  
2.7 V–3.6 V: 70 ns Max Access Time  
Optimized Architecture for Code Plus Data  
Storage  
Improved 12 V Production Programming  
Faster Production Programming  
No Additional System Logic  
128-bit Protection Register  
64-bit Unique Device Identifier  
64-bit User Programmable OTP Cells  
Extended Cycling Capability  
Minimum 100,000 Block Erase Cycles  
Supports Flash Data Integrator Software  
Flash Memory Manager  
Eight 4-Kword Blocks, Top or Bottom  
Locations  
Up to One Hundred-Twenty-Seven 32-  
Kword Blocks  
System Interrupt Manager  
Fast Program Suspend Capability  
Fast Erase Suspend Capability  
Flexible Block Locking  
Supports Parameter Storage, Streaming  
Data (e.g., voice)  
Automated Word/Byte Program and Block  
Lock/Unlock Any Block  
Erase  
Command User Interface  
Full Protection on Power-Up  
WP# Pin for Hardware Block Protection  
VPP = GND Option  
Status Registers  
Cross-Compatible Command Support  
Intel Basic Command Set  
VCC Lockout Voltage  
Common Flash Interface  
Low Power Consumption  
—9 mA Typical Read Power  
—7 µA Typical Standby Power with  
Automatic Power Savings Feature  
Extended Temperature Operation  
40 °C to +85 °C  
x16 I/O for Various Applications  
48-Ball µBGA* Package  
48-Ball VF BGA Package  
64-Ball Easy BGA Package  
48-Lead TSOP Package  
0.18 µ ETOX™ VII Flash Technology  
The 3 Volt Advanced+ Boot Block Flash memory, manufactured on Intel’s latest 0.18 µ  
technology, represents a feature-rich solution for low power applications. 3 Volt Advanced+  
Boot Block Flash memory devices incorporate low voltage capability (2.7 V read, program and  
erase) with high-speed, low-power operation. Flexible block locking allows any block to be  
independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI)  
software and you have a cost-effective, flexible, monolithic code plus data storage solution.  
Intel® 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 48-ball  
µBGA*, 48-ball Very Thin Profile Fine Pitch BGA (VF BGA), and 64-ball Easy BGA  
packages. Additional information on this product family can be obtained by accessing the Intel®  
Flash website: http://www.intel.com/design/flash.  
Notice: This document contains preliminary information on new products in production. The  
specifications are subject to change without notice. Verify with your local Intel sales office that  
you have the latest datasheet before finalizing a design.  
Order Number: 290645-009  
April 2000  

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