Twin Diode Module
TDM300
A
D
E
Dim. Inches
Millimeters
Min.
Max. Min.
Max. Notes
Baseplate
A=Common Anode
A
B
C
D
E
F
G
H
J
---
1.240
---
3.99 BSC
1.98 BSC
0.320
---
0.630
0.680
0.610
4.600
1.260
.925
---
31.49
---
101.34 BSC
50.29 BSC
8.13
---
16.00
17.27
15.49
---
4.62
116.84
32.00
23.49
B
F
G
Dia.
5/16-18
0.340
---
---
0.780
0.640
.100
8.64
---
---
19.81
16.26
2.54
4.88
Baseplate
Common Cathode
K
H
H
K
L
M
---
0.182
C
0.192
Baseplate
D=Doubler
L
J
Notes:
Baseplate: Nickel plated
copper.
M
Microsemi
Working Peak
Reverse Voltage
200V
Repetitive Peak
Reverse Voltage
200V
Catalog Number
TDM30002*
TDM30004*
TDM30006*
TDM30008*
TDM30010*
TDM30012*
TDM30014*
TDM30016*
Compact Package
Glass Passivated Die
400V
600V
800V
1000V
1200V
1400V
1600V
400V
600V
800V
1000V
1200V
1400V
1600V
2 x 300 Amp Current Rating
Simplifies Circuit Assembly
Non-Isolated Baseplate
VRRM 200-1600 Volts
ROHS Compliant
*Add Suffix A for Common Anode, D for Doubler
Electrical Characteristics
I
I
I
T
T
R
R
F(AV) 600 Amps
F(AV) 300 Amps
C = 130°C, half sine, 0JC = 0.08°C/W
Average forward current per pkg
Average forward current per leg
Maximum surge current per leg
Max I2t for fusing
C = 130°C, half sine, 0JC = 0.15°C/W
T
FSM 5500 Amps
8.3 ms, half sine, J = 175°C
I2t 125990 A s
V
2
I
T
FM 1.1 Volts
FM = 300A: J = 25°C*
Max peak forward voltage per leg
Max peak reverse current per leg
Max peak reverse current per leg
I
V
V
T
RM 10 mA
RRM, J = 150°C
I
T
RM 75 uA
RRM, J = 25°C*
*Pulse test: Pulse width 8.33 msec, Duty cycle <1%
Thermal and Mechanical Characteristics
T
T
R
R
Storage temp range
STG
J
OJC
OCS
-55°C to 175°C
-55°C to 175°C
Operating junction temp range
Max thermal resistance per leg
Typical thermal resistance per leg (greased)
Terminal Torque
Mounting Base Torque (outside holes)
Mounting Base Torque (center hole)
center hole must be torqued first
Weight
0.15°C/W Junction to case
0.04°C/W Case to sink
60-75 inch pounds
30-40 inch pounds
8-10 inch pounds
9.3 ounces (263.7 grams) typical
www.microsemi.com
January, 2010 - Rev. 3