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73M2901CE-IGV/F PDF预览

73M2901CE-IGV/F

更新时间: 2024-01-07 01:06:44
品牌 Logo 应用领域
东电化 - TDK 电信电信集成电路
页数 文件大小 规格书
19页 130K
描述
Modem, PQFP32,

73M2901CE-IGV/F 技术参数

是否Rohs认证: 符合生命周期:Not Recommended
零件包装代码:QFP包装说明:QFP, TQFP32,.35SQ,32
针数:32Reach Compliance Code:compliant
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:7.71JESD-30 代码:S-PQFP-G32
端子数量:32最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装等效代码:TQFP32,.35SQ,32
封装形状:SQUARE封装形式:FLATPACK
电源:3/3.3 V认证状态:Not Qualified
子类别:Modems最大压摆率:15.5 mA
表面贴装:YES电信集成电路类型:MODEM
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.8 mm端子位置:QUAD
Base Number Matches:1

73M2901CE-IGV/F 数据手册

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73M2901CE  
V.22bis Single Chip Modem  
APRIL 2004  
DESCRIPTION  
FEATURES  
The 73M2901CE low speed modem integrates a  
data pump, controller, and analog front end in a 3.3V  
device with a powerful "AT" command host  
interface. The modem reduces external component  
count/cost by incorporating many features like  
parallel phone detect, Line-In-Use and Ring  
detection in software without additional components  
required.  
·
·
True one chip solution for embedded systems  
As low as 9.5mA operating with standby and  
power down mode available  
Power supply operation from 3.6V to 2.7V  
Data speed:  
V.22bis – 2400bps  
·
·
V.22/Bell212 – 1200bps  
V.21/Bell103 – 300bps  
V.23 – 1200/75bps (with PAVI turnaround)  
Bell202 – 1200bps  
Bell202/V23 4-wire operation  
International Call Progress support  
FCC68, CTR21, JATE, etc.  
Worldwide Caller ID capability  
Type I and II support  
The device is a "one chip fits all” solution for  
applications including set-top boxes, point-of-sale  
terminals, automatic teller machines, utility meters,  
vending machines and smart card readers.  
·
·
Another distinctive feature of this device is pin  
compatibility with TDK’s flagship embedded hard  
modems, the 73M2901CL, and the 73M1903 soft  
modem AFE. This offers customers a cost effective  
method to design for both hard or soft modem  
solutions in the same system as a risk-free cost  
reduction path.  
·
·
·
·
·
·
EIA 777 compliant  
DTMF generation and detection  
SMS messaging support  
On chip hybrid driver  
Blacklisting capability  
Line-In-Use and Parallel Pick-Up (911) detection  
with voltage or low cost energy detection method  
Incoming ring energy detection through CID path;  
no optocoupler required  
Manufacturing Self Test capability  
Backward compatible with 73M2901CL  
Packaging:  
Complete Support and Modem Reference Designs  
Error correction software and support are part of the  
solution offered by TDK Semiconductor. Our in-  
house application engineering team is here to help  
you meet your international certification needs.  
·
·
·
·
32 lead QFN  
32 pin TQFP packages  
BLOCK DIAGRAM  
Ó 2004 TDK Semiconductor Corporation  
04/15/04- V2.2.1  
1

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