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TDA8822M PDF预览

TDA8822M

更新时间: 2024-09-18 22:53:07
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
28页 191K
描述
Universal I2C-bus programmable RF modulator

TDA8822M 技术参数

生命周期:Obsolete零件包装代码:SSOP
包装说明:SSOP,针数:24
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84商用集成电路类型:CONSUMER CIRCUIT
JESD-30 代码:R-PDSO-G24JESD-609代码:e4
长度:8.2 mm功能数量:1
端子数量:24最高工作温度:85 °C
最低工作温度:-20 °C封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH认证状态:Not Qualified
座面最大高度:2 mm最大压摆率:72 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
表面贴装:YES温度等级:OTHER
端子面层:NICKEL PALLADIUM GOLD端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
宽度:5.3 mmBase Number Matches:1

TDA8822M 数据手册

 浏览型号TDA8822M的Datasheet PDF文件第2页浏览型号TDA8822M的Datasheet PDF文件第3页浏览型号TDA8822M的Datasheet PDF文件第4页浏览型号TDA8822M的Datasheet PDF文件第5页浏览型号TDA8822M的Datasheet PDF文件第6页浏览型号TDA8822M的Datasheet PDF文件第7页 
INTEGRATED CIRCUITS  
DATA SHEET  
TDA8822  
Universal I2C-bus programmable  
RF modulator  
1997 Jan 08  
Preliminary specification  
File under Integrated Circuits, IC02  

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