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TDA8351AQ PDF预览

TDA8351AQ

更新时间: 2024-09-23 22:53:07
品牌 Logo 应用领域
恩智浦 - NXP 消费电路商用集成电路偏转集成电路
页数 文件大小 规格书
16页 86K
描述
DC-coupled vertical deflection output circuit

TDA8351AQ 技术参数

生命周期:Active包装说明:ZIP, ZIP13,.2,.17,67
Reach Compliance Code:compliant风险等级:5.25
Is Samacsys:N商用集成电路类型:VERTICAL DEFLECTION IC
JESD-30 代码:R-PZIP-T13端子数量:13
最高工作温度:70 °C最低工作温度:-25 °C
封装主体材料:PLASTIC/EPOXY封装代码:ZIP
封装等效代码:ZIP13,.2,.17,67封装形状:RECTANGULAR
封装形式:IN-LINE电源:9/25 V
认证状态:Not Qualified子类别:Deflection ICs
表面贴装:NO技术:BIPOLAR
温度等级:OTHER端子形式:THROUGH-HOLE
端子节距:1.7 mm端子位置:ZIG-ZAG
Base Number Matches:1

TDA8351AQ 数据手册

 浏览型号TDA8351AQ的Datasheet PDF文件第2页浏览型号TDA8351AQ的Datasheet PDF文件第3页浏览型号TDA8351AQ的Datasheet PDF文件第4页浏览型号TDA8351AQ的Datasheet PDF文件第5页浏览型号TDA8351AQ的Datasheet PDF文件第6页浏览型号TDA8351AQ的Datasheet PDF文件第7页 
INTEGRATED CIRCUITS  
DATA SHEET  
TDA8351AQ  
DC-coupled vertical deflection  
output circuit  
Product specification  
1999 Sep 27  
Supersedes data of January 1995  
File under Integrated Circuits, IC02  

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