是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | HLFQFP, QFP100,.63SQ,20 | 针数: | 100 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.67 | Is Samacsys: | N |
商用集成电路类型: | CONSUMER CIRCUIT | JESD-30 代码: | S-PQFP-G100 |
JESD-609代码: | e4 | 长度: | 14 mm |
功能数量: | 1 | 端子数量: | 100 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HLFQFP |
封装等效代码: | QFP100,.63SQ,20 | 封装形状: | SQUARE |
封装形式: | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.6 mm | 子类别: | Other Consumer ICs |
最大压摆率: | 490 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3.15 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 14 mm |
Base Number Matches: | 1 |
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