生命周期: | Obsolete | 零件包装代码: | SOIC |
包装说明: | PLASTIC, HSOP-20 | 针数: | 20 |
Reach Compliance Code: | unknown | HTS代码: | 8542.31.00.01 |
风险等级: | 5.58 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | R-PDSO-G20 | JESD-609代码: | e4 |
长度: | 15.9 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 20 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG |
峰值回流温度(摄氏度): | 245 | 认证状态: | Not Qualified |
座面最大高度: | 3.5 mm | 最大供电电压 (Vsup): | 18 V |
最小供电电压 (Vsup): | 9.5 V | 标称供电电压 (Vsup): | 14.4 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | SILVER | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 11 mm |
Base Number Matches: | 1 |
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