生命周期: | Active | 零件包装代码: | QFP |
包装说明: | QFP, QFP64,.6SQ | 针数: | 64 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.66 | Is Samacsys: | N |
商用集成电路类型: | CONSUMER CIRCUIT | JESD-30 代码: | S-PQFP-G64 |
JESD-609代码: | e0 | 长度: | 12 mm |
功能数量: | 1 | 端子数量: | 64 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | QFP |
封装等效代码: | QFP64,.6SQ | 封装形状: | SQUARE |
封装形式: | FLATPACK | 电源: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 1.85 mm |
子类别: | Other Consumer ICs | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | QUAD |
宽度: | 12 mm | Base Number Matches: | 1 |
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