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TC7SZ38FU PDF预览

TC7SZ38FU

更新时间: 2024-11-24 04:28:47
品牌 Logo 应用领域
东芝 - TOSHIBA 栅极逻辑集成电路光电二极管
页数 文件大小 规格书
7页 189K
描述
2-Input NAND Gate(Open Drain Output)

TC7SZ38FU 技术参数

是否无铅:不含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:SSOP
包装说明:0.65 MM PITCH, PLASTIC, SSOP-5针数:5
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.4Is Samacsys:N
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G5
JESD-609代码:e2长度:2 mm
负载电容(CL):50 pF逻辑集成电路类型:NAND GATE
最大I(ol):0.024 A功能数量:1
输入次数:2端子数量:5
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:OPEN-DRAIN封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP5/6,.08
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3 V
Prop。Delay @ Nom-Sup:5.2 ns传播延迟(tpd):13.2 ns
认证状态:Not Qualified座面最大高度:1.1 mm
子类别:Gates最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.8 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN SILVER
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.25 mmBase Number Matches:1

TC7SZ38FU 数据手册

 浏览型号TC7SZ38FU的Datasheet PDF文件第2页浏览型号TC7SZ38FU的Datasheet PDF文件第3页浏览型号TC7SZ38FU的Datasheet PDF文件第4页浏览型号TC7SZ38FU的Datasheet PDF文件第5页浏览型号TC7SZ38FU的Datasheet PDF文件第6页浏览型号TC7SZ38FU的Datasheet PDF文件第7页 
TC7SZ38F/FU  
TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic  
TC7SZ38F,TC7SZ38FU  
2-Input NAND Gate(Open Drain Output)  
Features  
TC7SZ38F  
High output drive: 24 mA (min) @V  
= 3 V  
CC  
Super high speed operation:  
t
2.2 ns(typ.)@V  
= 5 V, 50 pF  
pz =  
CC  
Operation voltage range: V  
= 1.80~5.5 V  
CC (opr)  
5.5V tolerant inputs.  
Power down protection is provided on output.  
Matches the performance of TC74LCX series when operated  
at 3.3 V V  
.
CC  
TC7SZ38FU  
Marking  
Type name  
J D  
Weight  
SSOP5-P-0.95  
SSOP5-P-0.65A  
: 0.016 g (typ.)  
: 0.006 g (typ.)  
Absolute Maximum Ratings (Ta = 25°C)  
Pin Assignment (top view)  
Characteristics  
Power supply voltage  
Symbol  
Rating  
Unit  
V
0.5~6  
0.5~6  
0.5~6  
20  
V
V
CC  
DC input voltage  
V
IN  
1
2
3
5
4
VCC  
IN A  
DC output voltage  
Input diode current  
Output diode current  
DC output current  
V
V
OUT  
I
mA  
mA  
mA  
mA  
mW  
°C  
IK  
IN B  
I
20  
OK  
I
50  
OUT Y  
OUT  
GND  
DC V /ground current  
CC  
I
±50  
CC  
Power dissipation  
P
200  
D
Storage temperature  
Lead temperature (10s)  
T
stg  
65~150  
260  
T
°C  
L
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings and the operating ranges.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report  
and estimated failure rate, etc).  
1
2007-11-01  

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