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TC74HC670P PDF预览

TC74HC670P

更新时间: 2024-02-06 21:46:25
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
7页 291K
描述
IC SPECIALTY MEMORY CIRCUIT, PDIP16, PLASTIC, DIP-16, Memory IC:Other

TC74HC670P 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP,
针数:16Reach Compliance Code:unknown
HTS代码:8542.32.00.71风险等级:5.83
JESD-30 代码:R-PDIP-T16JESD-609代码:e0
长度:19.304 mm内存密度:16 bit
内存集成电路类型:MEMORY CIRCUIT内存宽度:4
功能数量:1端子数量:16
字数:4 words字数代码:4
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:4X4
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:5 mm最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V表面贴装:NO
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

TC74HC670P 数据手册

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