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TC62D749CFG PDF预览

TC62D749CFG

更新时间: 2024-09-16 14:56:15
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
22页 866K
描述
Not Recommended for New Design

TC62D749CFG 数据手册

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TC62D749CFG  
TOSHIBA CDMOS Integrated Circuit Silicon Monolithic  
TC62D749CFG  
16-Output Constant Current LED Driver (Output switching high-speed version)  
The TC62D749CFG is a constant-current driver for LED and  
LED display lighting applications.  
The output current from each of the 16 outputs is  
programmable via a single external resistor.  
The TC62D749CFG contains a 16-channel shift register, a  
16-channel latch, a 16-channel AND gate and a 16-channel  
constant-current output.  
Fabricated with a CMOS process, the TC62D749CFG allows  
high-speed data transfer.  
SSOP24-P-300-1.00B  
Weight: 0.29 g (Typ.)  
It operates with a 3.3- or 5-V power supply.  
Features  
Supply voltages  
: V  
= 3.0 V to 5.5 V  
= 1.5 to 90 mA  
DD  
16-output built-in  
Output current setup range  
: I  
OUT  
Constant current output accuracy (@ R  
EXT  
= 1.2 kΩ, V  
OUT  
= 1.0 V, V = 3.3 V, 5.0 V)  
DD  
: S rankbetween outputs ± 1.5 % (max)  
: S rankbetween devices: ± 1.5 % (max)  
: N rankbetween outputs ± 2.5 % (max)  
: N rankbetween devices: ± 2.5 % (max)  
Output voltage  
: V  
= 17 V (max)  
OUT  
wOE  
High-speed output switching  
: t  
= 25 ns (min), t = 10ns (typ.), t = 10ns (typ.)  
or of  
There is TC62D748 as an output switching standard-speed version of this product.  
: CMOS interfaces (Schmitt trigger input)  
I/O interface  
Data transfer frequency  
Operation temperature range  
: f  
= 25 MHz (max)  
SCK  
: T  
= 40 to 85 °C  
opr  
Power-on-reset function built-in. (When the power supply is turned on, internal data is reset)  
Package : SSOP24-P-300-1.00B  
For detailed part naming conventions, contact your local Toshiba sales representative or distributor.  
When the LED driver of high-speed output switching is used, back EMF may occur at the time of output OFF, and  
output terminal voltage may rise. Please be careful. It is necessary to reduce inductance to prevent the back EMF. It  
is possible to reduce inductance of a substrate by making the power supply for LED wiring shorter and wider  
designing the layout pattern.  
1
2014-10-01  
© 2014 TOSHIBA Corporation  

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