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TC55NEM208AFGN70 PDF预览

TC55NEM208AFGN70

更新时间: 2024-11-21 20:10:43
品牌 Logo 应用领域
东芝 - TOSHIBA 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
10页 204K
描述
IC 512K X 8 STANDARD SRAM, 70 ns, PDSO32, 0.525 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-32, Static RAM

TC55NEM208AFGN70 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:SOP, SOP32,.56
针数:32Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.8最长访问时间:70 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G32
长度:20.6 mm内存密度:4194304 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端子数量:32
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP32,.56
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V认证状态:Not Qualified
座面最大高度:2.8 mm最大待机电流:0.000002 A
最小待机电流:2 V子类别:SRAMs
最大压摆率:0.035 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.7 mm
Base Number Matches:1

TC55NEM208AFGN70 数据手册

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TC55NEM208AFGN/ATGN55,70  
TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS  
Lead-Free  
524,288-WORD BY 8-BIT STATIC RAM  
DESCRIPTION  
The TC55NEM208AFGN/ATGN is a 4,194,304-bit static random access memory (SRAM) organized as 524,288  
words by 8 bits. Fabricated using Toshiba's CMOS Silicon gate process technology, this device operates from a  
single 5V ± 10% power supply. Advanced circuit technology provides both high speed and low power at an operating  
current of 3 mA/MHz (typ) and a minimum cycle time of 55 ns. It is automatically placed in low-power mode at 1.8  
µA standby current (typ) when chip enable (CE ) is asserted high. There are two control inputs. CE is used to  
select the device and for data retention control, and output enable (OE ) provides fast memory access. This device is  
well suited to various microprocessor system applications where high speed, low power and battery backup are  
required. And, with a guaranteed operating range of 40° to 85°C, the TC55NEM208AFGN/ATGN can be used in  
environments exhibiting extreme temperature conditions. The TC55NEM208AFGN/ATGN is available in a  
standard plastic 32-pin small-outline package (SOP) and plastic 32-pin thin-small-outline package (TSOP).  
FEATURES  
Access Times (maximum):  
TC55NEM208AFGN/ATGN  
Low-power dissipation  
Operating: 15 mW/MHz (typical)  
Single power supply voltage of 5 V ± 10%  
Power down features using CE .  
Data retention supply voltage of 1.5 to 5.5 V  
Direct TTL compatibility for all inputs and outputs  
Wide operating temperature range of 40° to 85°C  
Standby Current (maximum):20 µA  
55  
70  
Access Time  
CE Access Time  
OE Access Time  
Package:  
55 ns  
55 ns  
30 ns  
70 ns  
70 ns  
35 ns  
SOP32-P-525-1.27 (AFGN)  
(Weight:1.12 g typ)  
TSOP II32-P-400-1.27 (ATGN) (Weight:0.52 g typ)  
Lead-Free  
PIN ASSIGNMENT (TOP VIEW)  
PIN NAMES  
32 PIN SOP & TSOP  
A0~A18  
R/W  
Address Inputs  
Read/Write Control  
Output Enable  
Chip Enable  
A18  
A16  
A14  
A12  
A7  
A6  
A5  
A4  
A3  
1
2
3
4
5
6
7
8
9
32 VDD  
31 A15  
30 A17  
29 R/W  
28 A13  
27 A8  
OE  
CE  
I/O1~I/O8  
Data Inputs/Outputs  
Power (+5 V)  
26 A9  
25 A11  
24 OE  
23 A10  
V
DD  
GND  
Ground  
A2 10  
A1 11  
22  
CE  
A0 12  
21 I/O8  
20 I/O7  
19 I/O6  
18 I/O5  
17 I/O4  
I/O1 13  
I/O2 14  
I/O3 15  
GND 16  
(AFGN/ATGN)  
2004-10-14 1/10  

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