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TC4423EG

更新时间： 2024-10-01 04:49:43
品牌 Logo 应用领域
美国微芯 - MICROCHIP 驱动器
页数 文件大小 规格书
18页 322K
描述
3A Dual High-Speed Power MOSFET Drivers

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TC4423EG 数据手册

 浏览型号TC4423EG的Datasheet PDF文件第2页浏览型号TC4423EG的Datasheet PDF文件第3页浏览型号TC4423EG的Datasheet PDF文件第4页浏览型号TC4423EG的Datasheet PDF文件第5页浏览型号TC4423EG的Datasheet PDF文件第6页浏览型号TC4423EG的Datasheet PDF文件第7页 
TC4423/TC4424/TC4425  
3A Dual High-Speed Power MOSFET Drivers  
General Description  
Features  
• High Peak Output Current: 3A  
• Wide Input Supply Voltage Operating Range:  
- 4.5V to 18V  
The TC4423/TC4424/TC4425 devices are a family of  
3A, dual-output buffers/MOSFET drivers. Pin compati-  
ble with the TC1426/27/28, TC4426/27/28 and  
TC4426A/27A/28A dual 1.5A driver families, the  
TC4423/24/25 family has an increased latch-up current  
rating of 1.5A, making them even more robust for  
operation in harsh electrical environments.  
• High Capacitive Load Drive Capability:  
- 1800 pF in 25 ns  
• Short Delay Times: <40 ns (typ)  
• Matched Rise/Fall Times  
As MOSFET drivers, the TC4423/TC4424/TC4425 can  
easily charge 1800 pF gate capacitance in under  
35 nsec, providing low enough impedances in both the  
on and off states to ensure the MOSFET's intended  
state will not be affected, even by large transients.  
• Low Supply Current:  
- With Logic ‘1’ Input – 3.5 mA (Max)  
- With Logic ‘0’ Input – 350 µA (Max)  
• Low Output Impedance: 3.5Ω (typ)  
The TC4423/TC4424/TC4425 inputs may be driven  
directly from either TTL or CMOS (2.4V to 18V). In  
addition, the 300 mV of built-in hysteresis provides  
noise immunity and allows the device to be driven from  
slowly rising or falling waveforms.  
• Latch-Up Protected: Will Withstand 1.5A Reverse  
Current  
• Logic Input Will Withstand Negative Swing Up To  
5V  
• ESD Protected: 4 kV  
• Pin compatible with the TC1426/TC1427/TC1428,  
TC4426/TC4427/TC4428 and TC4426A/  
TC4427A/TC4428A devices.  
• Space-saving 8-Pin 6x5 DFN Package  
Applications  
• Switch Mode Power Supplies  
• Pulse Transformer Drive  
• Line Drivers  
(1)  
Package Types  
TC4423 TC4424 TC4425  
8-Pin PDIP  
NC  
NC  
NC  
NC 1  
IN A 2  
GND 3  
IN B 4  
8
7
6
5
TC4423 TC4424 TC4425  
16-Pin SOIC (Wide)  
TC4423  
TC4424  
TC4425  
OUT A  
OUT A  
OUT A  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
NC  
IN A  
NC  
GND  
GND  
NC  
NC  
NC  
NC  
V
V
V
DD  
DD  
DD  
OUT A  
OUT A  
OUT A  
OUT A  
OUT A  
OUT A  
OUT B  
OUT B  
OUT B  
TC4423  
TC4424  
TC4425  
V
V
V
TC4423 TC4424 TC4425  
(2)  
DD  
DD  
DD  
8-Pin DFN  
V
V
V
12  
11  
10  
DD  
DD  
DD  
1
8
7
6
5
OUT B  
OUT B  
NC  
OUT B  
OUT B  
NC  
OUT B  
OUT B  
NC  
NC  
IN A  
GND  
IN B  
NC  
NC  
NC  
IN B  
NC  
TC4423  
TC4424  
TC4425  
2
OUT A  
OUT A  
OUT A  
9
3
V
V
V
DD  
DD  
DD  
4
OUT B  
OUT B  
OUT B  
Note 1: Duplicate pins must both be connected for proper operation.  
2: Exposed pad of the DFN package is electrically isolated.  
2004 Microchip Technology Inc.  
DS21421D-page 1  
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